Semiconductor Process Technician

2 weeks ago

Central Region, Singapore Adecco Personnel Pte Ltd. Full time $3,000 per year

Join a government-affiliated science agency and gain hands-on experience in cutting-edge flip chip bonding technology.

The Opportunity:
  • Our client, Government-affiliated Science Agency
  • Working Location: Science Park II
  • Basic Salary: Up to $3,000 (commensurate with experience)
  • Working hours: 4334, 9PM-9AM (Night shift only)
  • Training provided (Training on normal shift)
  • 1 year contract (Subjected to renewal/conversion)
Job Responsibilities:
  • Operate and monitor semiconductor equipment and recover process errors.
  • Execute process sequences and document tool parameters and die-level data.
  • Transport wafer lots within cleanroom environments.
  • Identify areas for improvement in cycle time, utilization, and cost.
  • Specialize in flip chip bonding processes including solder bump formation, die alignment, bonding, underfill, and inspection.
  • Understand and follow all Environmental, Health and Safety (EHS) procedures and requirements.
Job Requirements:
  • Nitec/Higher Nitec in Engineering, Electronics, Mechatronics or related fields.
  • Strong interest in hands-on technical work and learning from the ground up.
  • Hard Skills: Machine calibration, die bonding, tool recovery.
  • Soft Skills: Accurate documentation, adaptability, troubleshooting.
  • Must be comfortable with night shift operations.
Next Step:
  • Prepare your updated resume (please include your current salary package with full breakdown such as base, incentives, annual wage supplement, etc.) and expected package.
  • Simply click on 'Apply here' to drop your resume.
  • All shortlisted candidates will be contacted.

Jason Ng

Direct Line:

EA License No: 91C2918

Personnel Registration Number: R

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