
Yield & Process Integration Engineer
3 days ago
Job Responsibilities:
Focus on process yield engineering and bump process integration.
Collaborate with cross-functional teams to troubleshoot and resolve process-related issues observed during the wafer bumping process (both Dry and Wet), including the proposal and execution of Design of Experiments (DOEs).
Responsible to look into data analysis for yield and detect trend.
Lead continuous improvement projects & device qualifications using APQP approach.
Execute CIP (Continuous Improvement Program) or project handling that contributes yield & cost efficiency improvement.
Review and propose updates to calculated Statistical Process Control (SPC) limits to improve product quality and ensure process stability.
Take ownership of customer technical inquiries, perform detailed spec reviews, and lead the implementation of requirements for product offload transition from New Product Introduction (NPI) to mass production.
Overall coordinator of customer's initiated BKM exercise
Job Requirements:
Degree in Engineering.
Minimum 3 years of relevant experience preferably in the semiconductor industry.
Familiar with SPC, APQP, and data analysis tools.
Strong problem-solving and analytical skills.
Job Types: Full-time, Permanent
Pay: From $4,000.00 per month
Work Location: In person
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