Senior / Engineer – Yield & Process Integration
2 weeks ago
Responsibilities:
- Focus on process yield engineering and bump process integration. Collaborate with cross-functional teams to troubleshoot and resolve process-related issues observed during the wafer bumping process (both Dry and Wet), including the proposal and execution of Design of Experiments (DOEs)
- Responsible to look into data analysis for yield and detect trend
- Lead continuous improvement projects & device qualifications using APQP approach
- Execute CIP (Continuous Improvement Program) or project handling that contributes yield & cost efficiency improvement
- Review and propose updates to calculated Statistical Process Control (SPC) limits to improve product quality and ensure process stability
- Take ownership of customer technical inquiries, perform detailed spec reviews, and lead the implementation of requirements for product offload transition from New Product Introduction (NPI) to mass production
- Overall coordinator of customer's initiated BKM exercise
Requirements:
- Degree in Engineering
- Minimum 3 years of relevant experience preferably in the semiconductor industry
- Familiar with SPC, APQP, and data analysis tools
- Strong problem-solving and analytical skills
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