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Senior / Engineer – Yield & Process Integration

2 weeks ago

NorthEast Region, Singapore United Test And Assembly Center Limited (UTAC) Full time $80,000 - $120,000 per year

Responsibilities:

  • Focus on process yield engineering and bump process integration. Collaborate with cross-functional teams to troubleshoot and resolve process-related issues observed during the wafer bumping process (both Dry and Wet), including the proposal and execution of Design of Experiments (DOEs)
  • Responsible to look into data analysis for yield and detect trend
  • Lead continuous improvement projects & device qualifications using APQP approach
  • Execute CIP (Continuous Improvement Program) or project handling that contributes yield & cost efficiency improvement
  • Review and propose updates to calculated Statistical Process Control (SPC) limits to improve product quality and ensure process stability
  • Take ownership of customer technical inquiries, perform detailed spec reviews, and lead the implementation of requirements for product offload transition from New Product Introduction (NPI) to mass production
  • Overall coordinator of customer's initiated BKM exercise

Requirements:

  • Degree in Engineering
  • Minimum 3 years of relevant experience preferably in the semiconductor industry
  • Familiar with SPC, APQP, and data analysis tools
  • Strong problem-solving and analytical skills