Senior Bonding/Dicing/Griding Process Engineer

4 days ago


Kallang Way, Singapore RF360 SINGAPORE PTE LTD Full time $120,000 - $150,000 per year

Job Responsibilities

1.    Self-driven leader and team player with strong technical skills, systematic thinking, attention to detail, and a problem-solving mindset.

Committed to root cause analysis and implementing effective, controlled solutions to resolve process issues.

Lead engineering trials for process development and new equipment start-up.

Initiate and lead taskforces for short-term fixes and long-term improvements.

Take ownership and responsibility, fostering teamwork and accountability.

Drive cost savings by eliminating waste, sourcing alternatives, and improving efficiency.

Lead quality investigations and implement lasting solutions to enhance product and process reliability.

Ensure process compliance through hands-on involvement and strict adherence to procedures.

Coach and develop engineers and technicians to build technical capability and independence.

Address non-conformances effectively with structured corrective actions.

Maintain and update process controls like FMEA, OCAP, risk assessments, and SIPOC for critical processes.

  1. Ensure compliance with CSR, EHS, QM, ESD, 5S, and cleanroom standards.

Education/Experience Requirements

1. Bachelor's degree in physics, Chemistry, Materials Science, Electronics, or Electrical Engineering.

2. Minimum 4 years of related work experience in wafer process engineering and/or equipment maintenance.

3.    Expert in semiconductor processes, with hands-on experience in Wafer-Bonding / Wafer-Dicing / Wafer-Grinding.

4.    Experience in high volume production of electronics components in an MNC or semi-conductor industry.

5.    Possess strong technical competencies in his field of study.

6.    Good knowledge of statistical and quality tools.

7.    Able to work under pressure and with strong commitment at work.

Experience with software applications such as MS Power Point, Excel and Word.



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