Senior Bonding/Dicing/Grinding Equipment Engineer

4 days ago

Kallang Way, Singapore RF360 SINGAPORE PTE LTD Full time $80,000 - $120,000 per year

Job Responsibilities

1.     Establish effective preventive maintenance programs and equipment troubleshooting guide.

2.     Executive new equipment start-up, from facilities hook-up, vendor start-up, to acceptance of equipment for production.

3.     Establish stock levels of essential spares and consumables to support equipment maintenance-based forecasted manufacturing volume.

4.     Actively evaluate 2nd source part as part of cost reduction plan.

5.     Drive/ contribute in equipment fault investigations and continuous equipment improvement project (CIP) to resolve chronic equipment issues, and institute permanent resolutions to assure product quality and enhance process robustness.

6.     Enforce on controls and execution to conform to work instructions and procedures.  Apply hands-on and with deep involvement at work.

7.     Take accountability of work and possesses strong sense of responsibility and teamwork.

8.     Manage vendor services and supports and ensuring compliance with factory protocol.

9.     Perform other duties assigned. Duties are varying according to project progress and/or for specific goal of the department

10.   Manage vendor services and supports and ensuring compliance with factory protocol.

11.   Establish, review and perform regular update of PM procedures, Risks Assessments and Troubleshooting guidelines.

12.   Create technical specification for new and transferred equipment.

13.   Execute the equipment move-in, installation, set up and buy-off, meeting set timelines.

14.   Compliance with CSR, EHS, QM, ESD, 5S standard and cleanroom protocol.

Education/Experience Requirements

1.    Minimum Bachelor's degree in Electronic or Electrical Engineering or equivalent.

2.    Minimum 4 years of related work experience in wafer process engineering and/or equipment maintenance.

3.    Hands-on experience in troubleshooting of Wafer-Bonder or/and Wafer-Dicer/Grinder.

4.    Experience in high volume production of electronics components in an MNC or semi-conductor industry.

5.    Possess strong technical competencies in his field of study.

6.    Good knowledge of statistical and quality tools.

7.    Able to work under pressure and with strong commitment at work.

  1. Experience with computer systems and proficient with software applications such as MS Power Point, Excel and Word.

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