Engineer/snr Engineer, Heterogeneous Integration

**Our vision is to transform how the world uses information to enrich life for all.**

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

JR68645 Engineer/Snr Engineer, Heterogeneous Integration Group(HIG), High Bandwidth Memory(HBM)

As a member of the **HIG HBM Media Health HVM team **you will lead and develop a high-performing products driving Media Health Manufacturing and activities within the HBM Product and Systems Engineering Team. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization.

**Key Responsibilities**
- ** Optimized Test Coverage**: The responsibility of ensuring optimized test coverage on all current and future HIG HBM design architectures and process nodes is a technical aspect of this role. This is crucial for maintaining the effectiveness and efficiency in high-volume manufacturing.
- ** Promotion of Innovation**: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market.
- ** Product Development and Validation**: This role is pivotal in developing, validating, characterizing, and qualifying Micron’s next-generation HBM products. Ensuring that these products are reliable and meet the necessary standards is a technical task that directly impacts the market readiness of the products.
- ** Support for New Product Design Validation**: The role provides support for design verification and in-depth circuit of new products using CAD tools and Verilog simulations. This technical support is crucial for the development of new products and technologies.
- ** Yield Improvement and Cost Reduction**:The role involves technical tasks like improving manufacturing test yields (Specifically related to Device Issues from the DRAM, Interface and Stacked Die Yield), reducing test time, and resolving yield-related issues. These activities are critical for cost reduction and meeting yield targets.
- ** Root Cause and Resolution of Qual and RMA Device Issues.**
- ** Process Conversions and HVM**: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of NAND products, which are key components in many modern technologies.
- ** Risk Management**: The role requires communication with Product Managers/Leads to manage risks associated with DPM process conversions. This is crucial in ensuring that the conversions move at an appropriate pace, balancing the need for innovation with the need for stability and reliability.
- ** Project Management**: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.
- ** Technical Decision Making**:The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.
- ** Cross-Functional Collaboration**:This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

**Requirements**:

- Bachelors/Masters Electrical Engineering Degree with 4+ years of experience in the semiconductor industry. Micron and Product Engineering Experience is preferred.
- Demonstrating Strong Leadership Skills and Technical Skills 4+ years of experience in the semiconductor industry.
- Programming skills/experience (Python a plus); logic gate and transistor operation knowledge; circuit simulation or circuit debug skills/experience.
- Familiarity with DRAM operation a plus; semiconductor process knowledge a plus
- Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs).
- Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems.
- Strong sense of responsibility and accountability towards assigned role with professional work ethic.
- Work on site in Singapore with international travel to USA, Taiwan and Japan.