Pmts - 3D Heterogeneous Integration Engineer (Multi-layer Stacking for Hybrid Bonding Development)
6 days ago
**About GlobalFoundries**:
**Summary of Role**:
GlobalFoundries is seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer t o drive next-generation multi-layer stacking for hybrid bonding development.
**Essential Responsibilities**:
- Lead 3DHI process development efforts for the building blocks required for advanced packaging solution s needed in the product lines (e.g., multi-die stacking, fine pitch hybrid bond ing, etc.) and planning by working with the unit process engineers, manufacturing engineers, as well as directly with the tools & materials for the GF Singapore semiconductor fabs.
- Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs.
- Develop expertise in the processes, materials and tooling leveraging available characterization resources. Develop integration schemes to continuously improve yields and to reduce cycle time & costs.
- Collaborate with vendors and OSATs (Outsourced Assembly and Test) to develop new wafer level and die level 2.5D and 3D HI processes.
- Drive understanding of failure modes.
- Facilitate a dvanced p ackaging interactions between the GF Singapore Product Line/Fab teams and customers.
- Generate IP related to novel wafer integration & packaging technology.
**Other Responsibilities**:
- Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
- Take part in hiring of other Advanced Packaging team members in Singapore.
- Mentor and guide new hires to assume their roles and responsibilities.
- Other duties as assigned by manager.
**Required Qualifications**:
- Education - Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
- MS degree with at least 1 2 years of prior related work experience.
- Must have at least an overall 3.0 GPA and proven good academic standing.
- Language Fluency - English (Written & Verbal).
- Travel - Up to 20%.
**Preferred Qualifications**:
- Education - PhD education level preferred with at least 10 years of prior related work experience.
- Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
- Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
- Strong written and verbal communication skills.
- Strong planning & organizational skills.
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Singapore GlobalFoundries Full timePMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development)Join to apply for the PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development)role at GlobalFoundries PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development)3 days ago Be among...
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Singapore GlobalFoundries Full timePMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development)Join to apply for the PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development)role at GlobalFoundries PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development)3 days ago Be among...
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Singapore GlobalFoundries Full timePMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development) Join to apply for the PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development) role at GlobalFoundries PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development) 3 days ago...
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