PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development)

PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development)Join to apply for the PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development)role at GlobalFoundries PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development)3 days ago Be among the first 25 applicants Join to apply for the PMTS - 3D Heterogeneous Integration Engineer (multi-layer stacking for hybrid bonding development)role at GlobalFoundries Get AI-powered advice on this job and more exclusive features. About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit Summary Of Role GlobalFoundries is seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to drive next-generation multi-layer stacking for hybrid bonding development. Essential Responsibilities: Lead 3DHI process development efforts for the building blocks required for advanced packaging solutions needed in the product lines (e.g., multi-die stacking, fine pitch hybrid bonding, etc.) and planning by working with the unit process engineers, manufacturing engineers, as well as directly with the tools & materials for the GF Singapore semiconductor fabs. Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs. Develop expertise in the processes, materials and tooling leveraging available characterization resources. Develop integration schemes to continuously improve yields and to reduce cycle time & costs. Collaborate with vendors and OSATs (Outsourced Assembly and Test) to develop new wafer level and die level 2.5D and 3DHI processes. Drive understanding of failure modes. Facilitate advanced packaging interactions between the GF Singapore Product Line/Fab teams and customers. Generate IP related to novel wafer integration & packaging technology. Other Responsibilities: Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. Take part in hiring of other Advanced Packaging team members in Singapore. Mentor and guide new hires to assume their roles and responsibilities. Other duties as assigned by manager. Required Qualifications: Education – Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program. MS degree with at least 12 years of prior related work experience. Must have at least an overall 3.0 GPA and proven good academic standing. Language Fluency - English (Written & Verbal). Travel - Up to 20%. Preferred Qualifications: Education – PhD education level preferred with at least 10 years of prior related work experience. Demonstrated prior leadership experience in the workplace, school projects, competitions, etc. Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity. Strong written and verbal communication skills. Strong planning & organizational skills. Information about our benefits you can find here: Seniority level Seniority level Mid-Senior level Employment type Employment type Full-time Job function Job function Engineering and Information Technology Industries Appliances, Electrical, and Electronics Manufacturing, IT Services and IT Consulting, and Software Development Referrals increase your chances of interviewing at GlobalFoundries by 2x Get notified about new Integration Engineer jobs in Singapore . Engineering, SDLC & Runtime, Software Engineer, Associate, Singapore Core Engineering, SDLC Continuous Deployment Engineer, Associate/ Vice President, Singapore Senior Software Engineer, Site Reliability Engineering Core Engineering, SDLC Software Engineer, Associate/ Vice President, Singapore Platform Engineer - Up to $200k + Industry Leading Bonus - Elite FinTech Firm Full Stack Engineer (Business Automation)DevOps Engineering, Engineer (1 year contract)Core Engineering, SDLC Platform Software Engineer, Associate/ Vice President, Singapore Tech Operations, Integration Reliability Engineer We’re unlocking community knowledge in a new way. Experts add insights directly into each article, started with the help of AI. #J-18808-Ljbffr