Research Engineer

2 weeks ago

Singapore A*STAR Agency for Science, Technology and Research Full time

**About Us**: The Institute of Microelectronics (IME) is a global leader in semiconductor innovation, specializing in advanced wafer level packaging. Our research focuses on advanced packaging such as high-density Fan-Out Wafer-Level Packaging (FOWLP), 2.5D/3D packaging, and co-packaged optics. At IME, you?ll have access to state-of-the-art packaging equipment and be at the forefront of transformative research.
**Position Overview**: We are seeking a highly motivated Research Engineer to drive the development of advanced packaging processes. This role offers the opportunity to work on innovative technologies and contribute to high-impact projects that push the boundaries of semiconductor packaging.
**Key Responsibilities**:
**Innovative Process Development**: Lead the design and development of advanced assembly processes for 2.5D/3D packaging, Fan-Out Wafer-Level Packaging (FOWLP), and C2W hybrid bonding.
**Evaluation and Characterization**: Coordinate and execute comprehensive evaluations of processes, equipment, and materials. Develop and implement new process qualifications and establish manufacturing guidelines.
**Project Collaboration**: Work closely with project leaders to align on project requirements. Develop and enhance capabilities to meet evolving project needs.
**Intellectual Property and Reporting**: Generate detailed engineering reports and contribute to the creation of new intellectual properties (IPs) and knowledge areas (KHs). Strengthen the IP portfolio related to heterogeneous integration.
**Customer and Market Engagement**: Collaborate with internal and external stakeholders to understand future demands and develop the necessary capabilities to meet these needs.

**Requirements**:
**Educational Background**: Master's degree or bachelor's degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering.
**Experience**: Experience in process development or packaging R&D, with a strong track record in advanced packaging technologies is added advantage.
**Type of Employment**: Full-Time
**Work Location**: Science Park

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