Senior Staff, Packaging Engineer

3 days ago


Bedok, Singapore Advanced Micro Devices, Inc Full time

Overview:
**WHAT YOU DO AT AMD CHANGES EVERYTHING**

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences - the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.

AMD together we advance_

**Responsibilities**:
**THE PERSON**:
**KEY RESPONSIBILITIES**:

- Codesign with Signal/Power Integrity and PCB design team to complete a substrate layout that will meet the design objectives for performance, cost and quality.
- Support substrate design for probe card substrate, test chips and test vehicles for technology development.
- Codesign with SOC team to complete Bump matrix and Interposer design for 3D,2.5D, COWOS and other advanced packaging technologies (Chiplet).
- Contribute to the development and enhancements of processes and methodologies to improve design efficiency.
- Interact with Assembly houses and substrate vendors to achieve cost-efficient and high-quality design.
- Mentor Junior Colleagues to enhance layout practices.

**PREFERRED EXPERIENCE**:

- Minimum 8 years’ experience in designing complex substrate design or Silicon Interposers.
- Very good understanding of Signal Integrity and power integrity principles.
- Knowledge of using CAD Layout tools such as Cadence SIP, APD, Synopsys 3DICC, First Encounter, ICC2 or other Packaging or Silicon Physical Layout Software.
- Knowledge of Python, TCL, Perl or Skill Script Programming is a plus.
- Experience dealing with assembly, foundry, and substrate vendors.

**ACADEMIC CREDENTIALS**:

- B.A. Sc. in Electrical Engineering, Computer Engineering, or Engineering Science

**LOCATION**:
Singapore

LI-HR1

LI-HYBRID

Qualifications:

- Benefits offered are described: _AMD benefits at a glance_._


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