
Packaging Materials Intern
3 days ago
Overview:
**WHAT YOU DO AT AMD CHANGES EVERYTHING**
We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences - the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. This is who we are at our best. One Company. One Team.
AMD together we advance_
**Responsibilities**:
**Intern - Packaging **Materials**
**THE ROLE**:
We have a project for Material Characterization Study on Bill of Materials Used in Electronic Packaging. This project will be working on studying and characterizing the thermo-mechanical properties of electronic packaging materials for product development and reliability assessments.
**THE PERSON**:
We are looking for a self-driven individual with a willingness to learn, resourceful and passionate about technology.
**KEY RESPONSIBILITIES**:
- Experiment planning and execution (e.g. Dynamics Mechanical Analyzer Q800 / Thermomechanical Analyzer Q400 / Digital Image Correlation equipment)
- Sample preparation for different material characterization techniques
- Statistical and Data Analysis
- Define/refine Best Known Method (BKM) of material characterization techniques
- Conduct Gage Repeatability and Reproducibility study to determine the amount of variation in the measurement data due to the measurement system
**PREFERRED EXPERIENCE**:
- Basic knowledge of finite element analysis
**ACADEMIC CREDENTIALS**:
- Background in Mechanical/Materials Engineering
**LOCATION**:
Singapore
LI-JV1
Qualifications:
- Benefits offered are described: _AMD benefits at a glance
_._
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