
Power Package Designers
15 hours ago
Design with Customer support innovative package based on PEP technologies for Semiconductor Power Applications using IGBT, GaN, SiC and Si Mosfet devices with device driver integration where reasonable
- Perform design rule checks (DRC) and edit data to comply with manufacturing guidelines. (DFM)
- Identify limitations of the design and suggest improvements to meet DFM for new products. Provide feedback on process critical dimensions and product features.
- Itemize and correspond to design Issues with customers.
- Perform Package layout, identifying stackup specifications as appropriate and prepare designs for production
- Identify and lead any prototype work required in early design stage to verify use of new technology or concepts in product or process design to reduce risk and improve profitability.
- Recommend new design concepts and validate the concept feasibility using thermal/electrical modelling
- Follow the customer characterization and qualification of the power package
- Provide technical support to process engineers to evaluate and provide strategy for advanced processing / implementation of product packaging
- **Job Requirements**:
- Degree / Diploma in Electronic Engineering or equivalent
- Good engineering foundation and technical knowledge
- PCB / Substrate manufacturing knowledge
- 2D and 3D design know-how ( AutoDesk preferred )
- Background on semiconductor packaging and assembly processes
- Knowledge with semiconductor power packaging assembly (interconnection, epoxy encapsulation, thermal dissipation, electrical impedance)
- Good interpersonal, presentation & communication skills
- Passionate R&D with optimistic mindset
- Ability to research, develop and implement new technology and manufacturing techniques
- Well organized and independent and team player
- Must be willing to travel both international and domestic as required to remote plants, facilities, customers or suppliers.
- Senior/Staff level with at least 5 years experience in related field.
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