Package Design Engineer

1 day ago


Singapore SILICON BOX Full time

Package Design Engineer Responsible for product and tooling design. Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged. Responsibilities Generate, update, and revise electrical routing layout based on netlist or customer design. Generate test vehicle design and related PCB design. Generate reticle and stencil design. Generate other schematics or drawings as requested. Review, maintain and update design guidelines. Manage conversion of internal design into suppliers' final design. Document all drawing revisions and change records. Perform any other ad‐hoc duties as assigned. Requirements Minimum degree in electrical engineering or related discipline. Good understanding of design guidelines and experience generating risk assessment reports for Fan‐in/Fan‐out processes. Experience using Cadence APD for RDL routing and mask design for wafer‐level processes including Wafer bumping, WLCSP, BGA, eWLB, and other fan‐out processes (advantage). Hands‐on skills with design software tools such as LinkCad, Cadence, CAM350, AutoCAD, GDS, Gerber editors. Experience with PCB test board design. Fresh graduates are welcome to apply. Seniority Level Entry level Employment Type Full‐time Job Function Design, Engineering, and Manufacturing Industries Semiconductors #J-18808-Ljbffr



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