TCB (Thermo Compression Bonding) Process Engineer
5 days ago
Position title: TCB (Thermo Compression Bonding) Process Engineer Location: North Working Days: 5 Day A Week Working hours: 9:00am - 6:00pm Salary: $5000 - $8000 (depends experience)Responsibilities Develop and optimize TCB process parameters for flip chip or die-to-substrate bonding. Evaluate new materials (e.g. underfill, bumps, substrates) and bonding tools to improve process performance and reliability. Troubleshoot and resolve yield issues related to TCB bonding such as non-wet, misalignment, voids, delamination, or warpage. Define and maintain process documentation, control plans, and standard operating procedures (SOPs). Conduct DOE (Design of Experiments) and data analysis to validate process changes and drive process improvements. Work closely with equipment vendors to install, qualify, and maintain bonding tools (e.g., bonder heads, stages, temperature/power controls). Support NPI (New Product Introduction) and technology transfers from R&D to production. Collaborate with quality, reliability, and failure analysis teams for process qualification and root cause analysis. Ensure process stability and repeatability in volume manufacturing through SPC and inline monitoring. Maintain compliance with environmental, health, and safety standards. Experience on HBM, COWOS, 2.5D is a definite plus. Experience on N2 Environment is added advantage. Requirements Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field. Minimum 2–5 years of hands‐on experience in semiconductor packaging or advanced interconnect processes. Experience with TCB or similar bonding technologies (thermo‐sonic, thermocompression, eutectic bonding) is highly preferred. #J-18808-Ljbffr
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Mechanical Design Engineer
5 days ago
Singapore The Supreme HR Advisory Full timeMechanical Design Engineer ( TCB (Thermo Compression Bonding) / Semiconductor )Position title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Street Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Overview A TCB Design Engineer is responsible for designing, developing, and...
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Singapore The Supreme HR Advisory Full timeTCB (Thermo Compression Bonding) Design Engineer Location: Adimiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced...
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Back-end Packaging Design Engineer
2 weeks ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty StreetWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB)...
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TCB Design Engineer
5 days ago
Singapore The Supreme HR Advisory Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for...
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Mechanical Design Engineer
5 days ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timeOverview Position title : TCB (Thermo Compression Bonding) Design Engineer Location : Admiralty Street Working Days : 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Interested applicants can also send your resume to WA: (Ms Lynne) and allow our Consultant to match you with our Clients. No Charges will be incurred by...
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TCB Design Engineer
2 weeks ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timeOverview Position title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Street Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment...
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TCB Semiconductor Packaging Design Engineer
1 week ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timeTCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced...
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TCB Design Engineer
1 week ago
Singapore THE SUPREME HR ADVISORY PTE. LTD. Full timePosition title: TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages)Location: 8 Admiralty Street #06-13, Singapore Working Days: 5 Day A Week Working hours: 9:00am - 6:00pm Salary: $6000 - $8000 (depends experience)Overview Role Overview: We are seeking a Mechanical Design Engineer with expertise in designing die...
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Singapore The Supreme HR Advisory Full timeTCB Senior Engineer – Thermo-Mechanical Simulation (Semiconductor Packaging) Position title : Senior Engineer – Thermo-Mechanical Simulation (Semiconductor Packaging) Location: Admiralty. Working Days: 5 Day A Week. Working hours: 9:00am - 6:00pm. Salary: $4000 - $8000 (depends experience). Overview We are seeking an engineer to join our advanced...
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TCB Design Engineer
5 days ago
Singapore The Supreme HR Advisory Full timePosition title : TCB (Thermo Compression Bonding) Design Engineer (Fluxless) -Oxygen & Environmental Control Systems Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Role Overview The Mechanical Design Engineer will be responsible for designing systems to control and optimize oxygen...
