TCB Design Engineer

2 weeks ago


Singapore THE SUPREME HR ADVISORY PTE. LTD. Full time

Overview Position title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Street Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput. Key Responsibilities Design & Development: Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding. Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA). Planning, Scheduling and Costing of Machines Modules. Prototyping & Testing: Oversee fabrication of prototype modules and their integration with TCB platforms. Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation. Process & Manufacturing Support: Collaborate with Electrical, Vision and Software Engineers for the machine integration. Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls). Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems. Support



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