Fluxless TCB Design Engineer

Overview Position title: TCB (Thermo Compression Bonding) Design Engineer (Fluxless) - Oxygen & Environmental Control Systems Location: Admiralty Working Days: 5 Day A Week Working hours: 9:00am - 6:00pm Salary: $6000 - $8000 (depends experience)Role Overview The Mechanical Design Engineer will be responsible for designing systems to control and optimize...

Position title : TCB (Thermo Compression Bonding) Design Engineer (Fluxless) - Oxygen & Environmental Control Systems Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview The Mechanical Design Engineer will be responsible for designing systems to control and optimize oxygen...

TCB (Thermo Compression Bonding) Design Engineer (Fluxless) - Oxygen & Environmental Control Systems Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role OverviewThe Mechanical Design Engineer will be responsible for designing systems to control and optimize oxygen levels during Thermal...

Semiconductor Packaging Module Design Engineer (TCB / Die Handling) Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for...

Position title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty Street Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB)...

Position title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty StreetWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB)...

Position title : TCB (Thermo Compression Bonding) Design Engineer Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for...

Position title : TCB (Thermo Compression Bonding) Design Engineer Location: Admiralty StreetWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB)...

A semiconductor packaging technology firm based in Singapore is seeking a Head of Process Engineering. The role involves leading the development and qualification of bonding processes for advanced semiconductor packaging. Candidates should have over 8 years of experience in TCB or Hybrid Bonding, strong leadership skills, and a relevant degree. Competitive...

Position title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages) Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary : $6000 - $8000 (depends experience)Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor...