CMP Process Engineer

3 days ago

Singapore Refine Group Full time

Job Title: CMP Process Engineer (Manager / Senior Engineer) – Reference ID: 36943Salary Range: 8,000 - 14,000 SGD Our client is launching a new business and establishing a new factory in Singapore. They are seeking a talented CMP Process Engineer to join their team and contribute to advanced substrate manufacturing. Reports to: R&D Manager Responsibilities Process Development & Optimization: Develop and refine CMP processes for planarizing dielectric and metal layers (e.g., copper, dielectric) in advanced substrate manufacturing. Optimize polishing recipes, pad/slurry combinations, and process parameters to achieve planarity, low defectivity, and target thickness. Equipment & Tooling Support: Define equipment specifications and validate CMP tools. Monitor and maintain CMP tool performance, including pad conditioning, slurry delivery systems, and endpoint detection technologies. Yield & Quality Improvement: Investigate and resolve CMP-related defects (e.g., dishing, erosion, scratching, delamination). Implement process monitoring techniques such as thickness metrology (e.g., ellipsometry, profilometry) and defect inspection. Process Integration: Collaborate with upstream and downstream process owners (e.g., plating, lithography, etching) to ensure seamless integration. Support the development of process flows for advanced packaging substrates, including SAP/Damascene and ABF/PI/PID-based technologies. Data Analysis & Documentation: Perform statistical analysis (e.g., DOE, SPC) to identify and control critical process parameters. Document standard operating procedures (SOPs), work instructions, and control plans. Cross-Functional Collaboration: Work closely with design, product engineering, equipment vendors, and manufacturing teams to support process scale-up and new product introduction (NPI). Assist with customer qualifications and reliability testing as needed. What you will receive AWS Variable Bonus (based on company and individual performance)Annual Leave: 16–20 days Medical Leave Family care leave (2 days/year)Dental care Company phone will be provided Requirements & Preferences PhD or Master's degree in Materials Science, Chemical Engineering, Mechanical Engineering, or a related field. 5–10+ years of experience in CMP process development in semiconductor packaging, wafer fabrication, or substrate manufacturing. Hands‐on experience with CMP tools. Solid understanding of substrate technologies such as Damascene, SAP, ABF build‐up, or embedding. Experience with defect analysis tools (e.g., optical inspection, SEM, AFM). Familiarity with process integration for advanced packaging (e.g., 2.5D/3D IC, interposers). Knowledge of slurry chemistry, pad materials, and post‐CMP cleaning processes. Strong analytical, documentation, and problem‐solving skills. Effective communication and teamwork in a cross‐functional environment. Thank you for your interest. We will notify only shortlisted candidates. #J-18808-Ljbffr

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