(Sr.) Principal CMP Process Engineer
2 hours ago
We are looking for Engineering roles in preparation for the formation of the joint venture of NXP and VIS, known as VSMC. This posting is for a CMP and/or Wafer Bond Process Engineer in a high volume, 300mm wafer manufacturing environment. The qualified candidate must possess process knowledge of CMP/wafer grind and experience with the MIRRA and IPEC polishers &/or Disco grinder equipment sets. They must be competent problem solvers, capable of applying logic to isolate and determine root cause. They must be self‐motivated, tactical, and able to work with minimal direction. The candidate must have the ability to make good decisions with limited time and data in a quickly changing environment. The candidate will be expected to deal with multiple issues and shifting priorities, and as such, must be able to interact professionally with management, manufacturing and maintenance to improve overall area performance. The candidate must have strong verbal and written communication skills. Primary Responsibilities Sustain and improve CMP/Wafer Bond processes to meet manufacturing demand for throughput and cycle time Improve quality levels by driving to root cause to eliminate scrap and yield loss mechanisms Identify and execute cost reduction solutions to meet Factory budget goals Collaborate with integration, device, Manufacturing, Maintenance, and Process teams to improve overall CMP and Bond process performance Participate in and/or lead cross‐functional and lean activity teams. Reduce defectivity mechanisms and improve process control Work with minimal supervision, balancing competing priorities, to serve the needs of the engineering and manufacturing communities Drive equipment performance to maximize capacity and yield performance. Improve cost performance of equipment. Mentor engineers and provide technical leadership in CMP process improvement. Required Skills/Experience B.S. Degree in Electrical Engineering, Materials Science, Solid State Physics or other relevant engineering discipline is required. Minimum 15 years semiconductor CMP process engineering experience is required. Process knowledge of CMP/wafer grind and experience with the MIRRA and IPEC polishers &/or Disco grinder equipment sets. Strong background in SPC & FDC is required. Positive interpersonal skills, highly energetic and self‐motivated. Outstanding written and verbal communication skills. Ability to manage and execute multiple projects simultaneously and shift priorities to meet business needs. Demonstrated application of structured problem solving methodology along with creative thinking to drive to failure root cause. Demonstrated ability to meet commitments and deliver results. Demonstrated experience with Design of Experiments. Demonstrated experience with automated fault detection and control systems. General understanding of equipment component behavior. Seniority Level Mid‐Senior level Employment Type Full‐time Job Function Semiconductor Manufacturing Referrals increase your chances of interviewing at NXP Semiconductors by 2x. #J-18808-Ljbffr
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Principal CMP Process Engineer
4 days ago
Singapore NXP Semiconductors Full timePrincipal CMP Process Engineer page is loaded Principal CMP Process Engineer Apply locations Singapore time type Full time posted on Posted Today job requisition id R- We are looking for Process Engineer role in preparation for the formation of the joint venture of NXP and VIS, known as VSMC. Job Description This posting is for a CMP and/or Wafer Bond...
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Principal Process Engineer
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Process Engineer
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Singapore Systems on Silicon Manufacturing Co. Pte. Ltd. Full time**Responsibilities** - Sustain and improve daily operations in the Chemical Mechanical Processing (CMP) Module to meet goals. - Lead trouble-shooting & problem solving in Factory operations floor. - Drive CMP consumables improvement for defect reduction & better cost of ownership. - Implement SPC improvement & early fault detection systems. - Drive...
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CMP Process Master
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Singapore VisionPower Semiconductor Manufacturing Company Pte Ltd Full timeSenior / Principal Process Engineer (TF-CMP/CVD)VisionPower Semiconductor Manufacturing Company Pte Ltd – Tampines VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC) is a new joint-venture 300mm semiconductor wafer manufacturing fab to be built in Singapore. We are looking for committed, resilient and passionate talents to launch a promising...
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Senior / Principal Process Engineer (TF-CMP/CVD)
2 weeks ago
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CMP Process Engineer
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Singapore Reeracoen Singapore Pte. Ltd. Full time3 days ago Be among the first 25 applicants Job Title: CMP Process Engineer (Manager / Senior Engineer) Reference ID: 36943 Basic Salary: S$8,000 - S$14,000 Our client is launching a new business and establishing a new factory in Singapore. They are seeking a talented CMP Process Engineer to join their team and contribute to advanced substrate manufacturing....
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Singapore AcuTech Consulting Group Full timePrincipal / Sr. Principal Process Safety Consultant - Singapore Join to apply for the Principal / Sr. Principal Process Safety Consultant - Singapore role at AcuTech Consulting Group Principal / Sr. Principal Process Safety Consultant - Singapore 4 months ago Be among the first 25 applicants Join to apply for the Principal / Sr. Principal Process Safety...
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CMP Process Engineer
1 week ago
Singapore Reeracoen Singapore Pte Ltd Full timeOur client is launching a new business and establishing a new factory in Singapore. They are seeking a talented CMP Process Engineer to join their team and contribute to advanced substrate manufacturing. Reports to: R&D Manager Responsibilities Process Development & OptimizationDevelop and refine CMP processes for planarizing dielectric and metal layers...