Principal CMP Process Engineer

3 days ago

Singapore NXP Semiconductors Full time

Join to apply for the Principal CMP Process Engineer role at NXP Semiconductors This position is for a CMP and/or Wafer Bond Process Engineer in a high-volume, 300mm wafer manufacturing environment. The ideal candidate will have process knowledge of CMP/wafer grind and experience with MIRRA and IPEC polishers and/or Disco grinder equipment. They should be capable problem solvers, self-motivated, and able to work with minimal supervision, making good decisions in a fast-paced environment. Strong communication skills are essential. Primary Responsibilities Sustain and improve CMP/Wafer Bond processes to meet manufacturing throughput and cycle time requirements. Identify and eliminate scrap and yield loss mechanisms through root cause analysis. Implement cost reduction solutions to meet factory budget goals. Collaborate across teams to enhance overall process performance. Lead or participate in cross-functional and lean activity teams. Reduce defectivity and improve process control. Manage multiple priorities and serve engineering and manufacturing needs. Optimize equipment performance for capacity and yield. Improve equipment cost performance. Mentor engineers and lead CMP process improvements. Required Skills and Experience B.S. in Electrical Engineering, Materials Science, Physics, or related field. At least 15 years of semiconductor CMP process engineering experience. Experience with CMP/wafer grind, MIRRA, IPEC polishers, or Disco grinders. Strong background in SPC & FDC. Excellent interpersonal, verbal, and written communication skills. Proven ability to manage multiple projects and adapt priorities. Structured problem-solving skills and experience with DOE and automated fault detection systems. Understanding of equipment component behavior. This job is listed as a Mid-Senior level, full-time position in Management and Manufacturing within the Semiconductor and Electronics industries. The posting is recent, with no indication of expiration. #J-18808-Ljbffr

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