MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD | Package Development Engineering

2 weeks ago

Singapore MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD Full time

Responsibilities
Excellent execution on assembly process for 1st NPI success and smooth transfer process from NPI to HVM.
Excellent execution of the qualification of NPI products/packages build that proliferate from the pilot products and packages according to planned timeline.
Full responsibility on supporting NPI business process with process TRA, POS, PFMEA/QCP, risk mitigation, and documentation.
Deliver BIC yield and cost on product NPI with integration of DFx BIC package solution, process guideline, and design rules.
Collaboration with multi-functional team from NPI to LVM/HVM process transfer. On-time execution of NPI Customer samples and Engineering Samples build for new products and packages.
SME Process Owner Responsible for Continuous Improvement on Process Yield, Defect Elimination and Process Characterization
Process owner to perform on-time detection with data analysis for process yield improvement. Lead the defect elimination and continuous improvement action, with problem-solving methodology, statistical analysis, and integration solution decision.
Process owner to develop process recipe for BIC UPH, conducting process characterization to define process parameters and boundary.
Continuously develop in-depth assembly process technical knowledge, well understand process capability/tolerance/spec limit/CpK, and apply key tools PFMEA/QCP/APC/FDC/Alarm on assembly processes Cz/Development/NPI.
Global leader for cross-team collaboration on network BKM, process recipe spec and recipe standardization/conversion.
Technology Enablement and Development – Process, Material, Equipment
Participate and support Product Roadmap, to enable key process capability and technology development to ensure packaging solution is ready prior to 1st Qual Silicon delivery.
Frequent engagement with equipment and material supplier (at least interval of monthly or daily/weekly for process issues).
Collaboration with Supplier and involvement Supplier Roadmap (Material/Equipment/OSAT), to understand market trends and competitor’s direction, ensuring key process technology and capability enablement is in-line.
Frequent review and participation in Competitor Analysis, to understand market trends and competitor’s technology/capability boundary.
Engage and follow PDE business process (TGR, TORB, KEG interlock) for new technology qualification, alignment, and safe launch.
Teamwork and General Expectation
Trainer/Buddy/Mentor for new team members, build effective relationships within team and cross-team (peers, counterpart).
Regularly review data and direction with supervisor. Demonstrate sound data analysis and judgment. Present reports and findings with appropriate conclusions, recommendations, and decision-making.
Develop, or coordinate development of, training materials for existing/new processes.
Safety: Identify and promptly report hazards, follow safety procedures and area work rules including proper PPE, lockout, and chemical safety.
Qualification
Bachelor or Masters in Electrical Engineering, Materials Science, Chemical Engineering, or related field. A PhD is a plus.
1-3 or more years of experience in Semiconductor Manufacturing, Process & Equipment Engineering and/or New Product Introduction.
Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills, and proficiency in statistical analysis/method.
Be able to comfortably work across organizational boundaries and geographies.
Ability to effectively collaborate with multi-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
Organized, meticulous, and strong focus on results.
Excellent analytical skills.
Excellent communication and written skills.
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