Senior Device Physics Engineer for Semiconductor Packaging

2 days ago


Singapore MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. Full time

Micron Semiconductor Asia Operations PTE. LTD.

Job Summary:

We are seeking a highly skilled Senior Device Physics Engineer to join our Package Development Engineering team in Micron. As a key member of this team, you will play a critical role in preparing new DRAM, NAND or MNAND products and coordinating resources, testing, and analysis throughout the product lifecycle.

Key Responsibilities:
  • Enable new test signals in BE (Backend) to capture assembly-related failures.
  • Work with Test Solution Engineering (TSE) & Product Engineering (PE) to standardize test coverages & characteristics, define Char limits, and approve test-related changes.
  • Develop and sustain out-of-control-action-plans (OCAPs).
  • Provide lot disposition based on parametric data observation in case of out-of-control triggers.
  • Analyze probe and backend test data to ensure silicon & assembly processes meet product expectations.
  • Participate in Phase Gate review meetings, presenting data analysis and deciding on Phase Gate exits related to electrical Test data.
  • Analyze test failures, coordinate EFA & PFA to identify root causes, implement fixes for fails (Fab process, Design, or Assembly Process).
  • Finding correlations between test failures and assembly processes, updating databases with observed signatures.
Requirements:
  • Bachelor's/Master's in Electronics, Device Physics, Applied Physics, Electrical Engineering.
  • Solid understanding of device physics.
  • Knowledge in engineering statistics.
  • Experience in data (electrical) analysis and modeling (JMP, Spotfire).
  • Programming experience (Python or Perl).
  • Effective communication skills in written and spoken English.
  • Good multitasking and organizational skills, able to make decisions in complex situations.
  • Excellent problem-solving and analytical skills.
  • Experience in NAND/DRAM memory or related fields.
  • Knowledge in semiconductor packaging assembly processes.
  • Experience in fabrication processes, electrical characterization techniques, metrology techniques.
Salary:

$120,000 - $180,000 per year, depending on qualifications and experience.



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