SMTS - 3D Heterogeneous Integration (thermal solutions for advanced bonding)
2 days ago
**Summary of Role:** GlobalFoundries is seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to drive thermal solutions for next-generation hybrid bonding development.**Essential Responsibilities:** **Other Responsibilities:** Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.Mentor and guide new hires to assume their roles and responsibilities.Other duties as assigned by manager.**Required Qualifications:** Education – Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.MS degree with at least 10 years of prior related work experience.**Preferred Qualifications:** Education – PhD education level preferred with at least 8 years of prior related work experience.Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.Strong written and verbal communication skills.Strong planning & organizational skills.Information about our benefits you can find here: #J-18808-Ljbffr
-
Singapore GLOBALFOUNDRIES Full time**About GlobalFoundries**: **Summary of Role**: GlobalFoundries is seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer t o drive thermal solutions for next-generation hybrid bonding development. **Essential Responsibilities**: - Lead 3DHI process development efforts for establishing thermal solutions required for advanced packaging...
-
Scientist (Heterogeneous Integration), IME
2 weeks ago
Singapore A*STAR - Agency for Science, Technology and Research Full timeOverview Scientist (Heterogeneous Integration), IME The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Principal Scientist to join our team. This role is pivotal in advancing state-of-the-art chip-to-wafer and wafer-to-wafer hybrid bonding processes, developing cutting-edge fabrication...
-
Senior Scientist
2 weeks ago
Singapore A*STAR RESEARCH ENTITIES Full timeScientist/Senior Scientist – Process Integrator / Hybrid Bonding/ Heterogeneous Integration The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Principal Scientist to join our team. This role is pivotal in advancing state-of-the-art chip‐to‐wafer and wafer‐to‐wafer hybrid bonding...
-
Chip to Wafer Bonding Research Scientist
2 weeks ago
Singapore A*STAR - Agency for Science, Technology and Research Full timeChip to Wafer Bonding Research Scientist (APM), IME Join to apply for the Chip to Wafer Bonding Research Scientist (APM), IME role at A*STAR - Agency for Science, Technology and Research A research scientist working on Chip-to-Wafer (C2W) bonding processes primarily focuses on the development, optimization, characterization, and integration of advanced...
-
Singapore GLOBALFOUNDRIES Full time**About GlobalFoundries**: **Summary of Role**: GlobalFoundries is seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer t o drive next-generation fine pitch scaling for hybrid bonding development. **Essential Responsibilities**: - Lead 3DHI process development efforts for the building blocks required for advanced packaging solution s...
-
Singapore GLOBALFOUNDRIES Full time**About GlobalFoundries**: **Summary of Role**: GlobalFoundries is seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer t o drive next-generation multi-layer stacking for hybrid bonding development. **Essential Responsibilities**: - Lead 3DHI process development efforts for the building blocks required for advanced packaging solution s...
-
Singapore GLOBALFOUNDRIES Full time**About GlobalFoundries**: **Summary of Role**: GlobalFoundries is seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer t o drive TSV/TOV and post-processing (reveal, thinning, RDL, etc.) development efforts. **Essential Responsibilities**: - Lead 3DHI process development efforts for the building blocks (‘all things TSV/TOV’)...
-
Chip to Wafer Bonding Principal Scientist
1 week ago
Singapore A*STAR RESEARCH ENTITIES Full timeA research scientist working on Chip-to-Wafer (C2W) bonding processes primarily focuses on the development, optimization, characterization, and integration of advanced bonding techniques for semiconductor packaging and heterogeneous integration applications. Job Description Process Development and Optimization Innovate and develop new C2W bonding...
-
Advanced packaging Engineer
2 days ago
Singapore GLOBALFOUNDRIES SINGAPORE PTE. LTD. Full timeWe are seeking an experienced and highly motivated MTS/Principal Integration Engineer to lead our Advanced Packaging Program, with a specific focus on 2.5D and 3D heterogeneous integration technologies. The ideal candidate will have extensive knowledge and hands‐on experience in these advanced semiconductor packaging technologies, along with a strong...
-
W2W Bonding Research Scientist
1 week ago
Singapore A*STAR - Agency for Science, Technology and Research Full timeW2W Bonding Research Scientist (APM), IME Join to apply for the W2W Bonding Research Scientist (APM), IME role at A*STAR - Agency for Science, Technology and Research . Research scientists working on the wafer-to-wafer (W2W) bonding process are primarily responsible for developing, optimizing, and integrating advanced hybrid bonding techniques for...
