Chip to Wafer Bonding Research Scientist
1 week ago
Chip to Wafer Bonding Research Scientist (APM), IME Join to apply for the Chip to Wafer Bonding Research Scientist (APM), IME role at A*STAR - Agency for Science, Technology and Research A research scientist working on Chip-to-Wafer (C2W) bonding processes primarily focuses on the development, optimization, characterization, and integration of advanced bonding techniques for semiconductor packaging and heterogeneous integration applications. Job Description Process Development and Optimization: Innovate and develop new C2W bonding capabilities, including hybrid, fusion, thermocompression, and eutectic bonding methods. Investigate and refine related processes such as wafer cleaning, planarization (CMP), and post‐bonding annealing, addressing critical factors like warpage, bonding strength, and alignment accuracy. Evaluation and Characterization: Plan and execute comprehensive evaluations of processes, materials, and equipment. Conduct experiments for process characterization, data collection, and analysis to drive quality improvements. Assess the thermal, mechanical, and electrical performance of the bonded structures, ensuring they meet the requirements for advanced applications such as AI accelerators and 3D‐ICs. Project Collaboration and Integration: Work closely with process integration teams, project leaders, and senior staff to align on project requirements and troubleshoot issues for industry and grant projects. Collaborate with internal and external stakeholders, including industry partners and equipment suppliers, to define technology roadmaps and develop next‐generation capabilities. Documentation and Intellectual Property: Generate detailed engineering reports, research papers, and technical documents. Contribute to the creation of new intellectual properties (IPs), file patents, and document know‐how related to heterogeneous integration platforms. Publish research findings in prestigious scientific journals and present at conferences. Mentorship and Expertise: Act as a subject matter expert (SME) for both internal and external stakeholders. Mentor and inspire scientists, engineers and talents in the field of advanced semiconductor packaging technology. Job Requirements PhD in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering. Experience in chip‐to‐wafer bonding process development or packaging R&D, with a strong track record in advanced packaging technologies is an added advantage. Relevant experience in semiconductor packaging or process development. Seniority level: Associate Employment type: Full‐time Job function: Other Industry: Research Services #J-18808-Ljbffr
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Chip to Wafer Bonding Senior Research Scientist
2 weeks ago
Singapore A*STAR RESEARCH ENTITIES Full timeA research scientist working on Chip-to-Wafer (C2W) bonding processes primarily focuses on the development, optimization, characterization, and integration of advanced bonding techniques for semiconductor packaging and heterogeneous integration applications.Job Description: Process Development and Optimization Innovate and develop new C2W bonding...
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Chip to Wafer Bonding Principal Scientist
4 days ago
Singapore A*STAR RESEARCH ENTITIES Full timeA research scientist working on Chip-to-Wafer (C2W) bonding processes primarily focuses on the development, optimization, characterization, and integration of advanced bonding techniques for semiconductor packaging and heterogeneous integration applications. Job Description Process Development and Optimization Innovate and develop new C2W bonding...
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W2W Bonding Research Scientist
4 days ago
Singapore A*STAR - Agency for Science, Technology and Research Full timeW2W Bonding Research Scientist (APM), IME Join to apply for the W2W Bonding Research Scientist (APM), IME role at A*STAR - Agency for Science, Technology and Research . Research scientists working on the wafer-to-wafer (W2W) bonding process are primarily responsible for developing, optimizing, and integrating advanced hybrid bonding techniques for...
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W2W Bonding Senior Research Scientist
2 weeks ago
Singapore A*STAR RESEARCH ENTITIES Full timeResearch scientists working on the wafer-to-wafer (W2W) bonding process are primarily responsible for developing, optimizing, and integrating advanced hybrid bonding techniques for semiconductor applications like 2.5D and 3D IC packaging.Job Description: Research and Development Process Innovation: Leading the design and development of innovative W2W bonding...
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W2W Bonding Senior Research Scientist
8 hours ago
Singapore A*STAR RESEARCH ENTITIES Full timeResearch scientists working on the wafer-to-wafer (W2W) bonding process are primarily responsible for developing, optimizing, and integrating advanced hybrid bonding techniques for semiconductor applications like 2.5D and 3D IC packaging. Job Description Research and Development Process Innovation: Leading the design and development of innovative W2W bonding...
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Senior Scientist
1 week ago
Singapore A*STAR RESEARCH ENTITIES Full timeScientist/Senior Scientist – Process Integrator / Hybrid Bonding/ Heterogeneous Integration The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Principal Scientist to join our team. This role is pivotal in advancing state-of-the-art chip‐to‐wafer and wafer‐to‐wafer hybrid bonding...
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Scientist (Heterogeneous Integration), IME
1 week ago
Singapore A*STAR - Agency for Science, Technology and Research Full timeOverview Scientist (Heterogeneous Integration), IME The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Principal Scientist to join our team. This role is pivotal in advancing state-of-the-art chip-to-wafer and wafer-to-wafer hybrid bonding processes, developing cutting-edge fabrication...
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Senior Scientist
8 hours ago
Singapore A*STAR - Agency for Science, Technology and Research Full timeSenior Scientist (Far BEOL – Advanced Process Modules), IME Responsibilities Develop Chip-to-Wafer (C2W) bonding process capabilities using fusion, hybrid, thermocompression, and eutectic bonding for photonics heterogeneous integration and advanced packaging applications. Lead module loop integration for layer
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Research Engineer
2 weeks ago
Singapore A*STAR Agency for Science, Technology and Research Full timeKey Responsibilities Research and develop advanced fine-pitch flip-chip & hybrid bonding techniques for chip-to-wafer, emphasizing bonding parameter optimization and process enhancements. Optimize Chip to wafer hybrid bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding...
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W2W Bonding Scientist — 3D IC
4 days ago
Singapore A*STAR - Agency for Science, Technology and Research Full timeA leading research agency in Singapore is seeking a W2W Bonding Research Scientist. This role involves developing advanced bonding techniques for semiconductor applications, optimizing parameters for high bonding strength, and conducting reliability tests. A PhD in relevant fields is necessary, along with experience in the W2W bonding process. The position...
