Chip to Wafer Bonding Senior Research Scientist

13 hours ago

Singapore A*STAR RESEARCH ENTITIES Full time

A research scientist working on Chip-to-Wafer (C2W) bonding processes primarily focuses on the development, optimization, characterization, and integration of advanced bonding techniques for semiconductor packaging and heterogeneous integration applications.Job Description: Process Development and Optimization Innovate and develop new C2W bonding capabilities, including hybrid, fusion, thermocompression, and eutectic bonding methods. Investigate and refine related processes like wafer cleaning, planarization (CMP), and post-bonding annealing, addressing critical factors such as warpage, bonding strength, and alignment accuracy. Evaluation and Characterization Plan and execute comprehensive evaluations of processes, materials, and equipment. Conduct experiments for process characterization, data collection, and analysis to drive quality improvements. Assess the thermal, mechanical, and electrical performance of the bonded structures, ensuring they meet the requirements for advanced applications like AI accelerators and 3D-ICs. Project Collaboration and Integration Work closely with process integration teams, project leaders, and senior staff to align on project requirements and troubleshoot issues for industry and grant projects. Collaborate with internal and external stakeholders, including industry partners and equipment suppliers, to define technology roadmaps and develop next-generation capabilities. Documentation and Intellectual Property Generate detailed engineering reports, research papers, and technical documents. Contribute to the creation of new intellectual properties (IPs), file patents, and document know-how related to heterogeneous integration platforms. Publish research findings in prestigious scientific journals and present at conferences. Mentorship and Expertise Act as a subject matter expert (SME) for both internal and external stakeholders. Mentor and inspire scientists, engineers and talents in the field of advanced semiconductor packaging technology. Job Requirements: PhD in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering. Experience in chip to wafer bonding process development or packaging R&D, with a strong track record in advanced packaging technologies is added advantage. Relevant experience in semiconductor packaging or process development.

  • Chip to Wafer Bonding Principal Scientist

    2 weeks ago

    Singapore A*STAR RESEARCH ENTITIES Full time

    A research scientist working on Chip-to-Wafer (C2W) bonding processes primarily focuses on the development, optimization, characterization, and integration of advanced bonding techniques for semiconductor packaging and heterogeneous integration applications. Job Description Process Development and Optimization Innovate and develop new C2W bonding...

  • W2W Bonding Senior Research Scientist

    13 hours ago

    Singapore A*STAR RESEARCH ENTITIES Full time

    Research scientists working on the wafer-to-wafer (W2W) bonding process are primarily responsible for developing, optimizing, and integrating advanced hybrid bonding techniques for semiconductor applications like 2.5D and 3D IC packaging.Job Description: Research and Development Process Innovation: Leading the design and development of innovative W2W bonding...

  • W2W Bonding Research Scientist

    2 weeks ago

    Singapore A*STAR RESEARCH ENTITIES Full time

    Research scientists working on the wafer-to-wafer (W2W) bonding process are primarily responsible for developing, optimizing, and integrating advanced hybrid bonding techniques for semiconductor applications like 2.5D and 3D IC packaging. Job Description Research and Development Process Innovation: Leading the design and development of innovative W2W bonding...

  • W2W Bonding Research Scientist

    2 weeks ago

    Singapore Agency for Science, Technology and Research (A*STAR) Full time

    Research scientists working on the wafer-to-wafer (W2W) bonding process are primarily responsible for developing, optimizing, and integrating advanced hybrid bonding techniques for semiconductor applications like 2.5D and 3D IC packaging. Job Description Research and Development Process Innovation: Leading the design and development of innovative W2W bonding...

  • Research Engineer

    2 days ago

    Singapore A*STAR Agency for Science, Technology and Research Full time

    Key Responsibilities Research and develop advanced fine-pitch flip-chip & hybrid bonding techniques for chip-to-wafer, emphasizing bonding parameter optimization and process enhancements. Optimize Chip to wafer hybrid bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding...

  • Semiconductor Process Engineer

    5 days ago

    Singapore THE SUPREME HR ADVISORY PTE. LTD. Full time

    Laser-Assisted Bonder (LAB) process engineer Location: Sembawang Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Overview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced Packaging...

  • Senior Scientist/ Principal Scientist

    1 week ago

    Singapore A*STAR Agency for Science, Technology and Research Full time

    Key Responsibilities Conceptualise and lead internal capability development and external industry projects involving new materials, advanced process integration approaches, and innovative concepts. Lead multi-disciplinary project team for the execution of industry projects with manageable risks and mentor less experienced colleagues. Engage and manage...

  • Semiconductor Bonding Laser Engineer

    5 days ago

    Singapore THE SUPREME HR ADVISORY PTE. LTD. Full time

    Position title: Semiconductor Bonding Laser Engineer Location: Admiralty Working Days: 5 Day A Week Working hours: 9:00am - 6:00pm Salary: $6000 - $8000 (depends experience)Overview A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced Packaging...

  • Scientist/Senior Scientist

    5 days ago

    Singapore A*STAR - Agency for Science, Technology and Research Full time

    Join to apply for the Scientist/Senior Scientist (MEMS), IME role at A*STAR - Agency for Science, Technology and Research The Micro Electro Multiphysical Systems (MEMS) team is looking for a MEMS fabrication process integrator. The researcher will work with a multidisciplinary team to develop processes for the fabrication of MEMS-based acoustic/ultrasonic...

  • Application / Process Engineer - Die Bond Tools

    13 hours ago

    Singapore CAPCON SINGAPORE PTE. LTD. Full time

    Company Overview: Capcon Limited Ltd. is a leading provider of high-performance equipment and innovative solutions for the advanced semiconductor assembly and packaging industry. In response to increasing market demand for next-generation packaging technologies, Capcon delivers cutting-edge solutions powered by a world-class engineering team. Our product...