Chip to Wafer Bonding Principal Scientist

4 days ago

Singapore A*STAR RESEARCH ENTITIES Full time

A research scientist working on Chip-to-Wafer (C2W) bonding processes primarily focuses on the development, optimization, characterization, and integration of advanced bonding techniques for semiconductor packaging and heterogeneous integration applications. Job Description Process Development and Optimization Innovate and develop new C2W bonding capabilities, including hybrid, fusion, thermocompression, and eutectic bonding methods. Investigate and refine related processes like wafer cleaning, planarization (CMP), and post-bonding annealing, addressing critical factors such as warpage, bonding strength, and alignment accuracy. Evaluation and Characterization Plan and execute comprehensive evaluations of processes, materials, and equipment. Conduct experiments for process characterization, data collection, and analysis to drive quality improvements. Assess the thermal, mechanical, and electrical performance of the bonded structures, ensuring they meet the requirements for advanced applications like AI accelerators and 3D-ICs. Project Collaboration and Integration Work closely with process integration teams, project leaders, and senior staff to align on project requirements and troubleshoot issues for industry and grant projects. Collaborate with internal and external stakeholders, including industry partners and equipment suppliers, to define technology roadmaps and develop next-generation capabilities. Documentation and Intellectual Property Generate detailed engineering reports, research papers, and technical documents. Contribute to the creation of new intellectual properties (IPs), file patents, and document know-how related to heterogeneous integration platforms. Publish research findings in prestigious scientific journals and present at conferences. Mentorship and Expertise Act as a subject matter expert (SME) for both internal and external stakeholders. Mentor and inspire scientists, engineers and talents in the field of advanced semiconductor packaging technology. Job Requirements PhD in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering. Experience in chip to wafer bonding process development or packaging R&D, with a strong track record in advanced packaging technologies is added advantage. Relevant experience in semiconductor packaging or process development. #J-18808-Ljbffr

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