Process & Design Engineer Thermal Simulation | Admiralty | Up to 8000 - SM09

2 weeks ago


Singapore THE SUPREME HR ADVISORY PTE. LTD. Full time
Roles & Responsibilities

TCB (Thermo Compression Bonding) Design Engineer

Location: Admiralty
Work Schedule: 5-day week (Mon–Fri, 9:00 AM–6:00 PM)
Salary: S$ 6,000 – 8,000 (experience-based)

Key Responsibilities

Design TCB modules for Chip-to-Wafer/ Chip-to-Substrate bonding. Create 3D models, 2D drawings, BOMs, FMEA, DFMA. Manage Prototyping, Testing, and Troubleshooting for thermal performance. Optimize Heating/ Cooling Systems (thermal simulations: CFD/FEA). Collaborate with Electrical, Vision, and Software teams for machine integration. Ensure DFMA compliance and support production

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