Engineer, Advanced Packaging Die Level Technology Engineering
5 days ago
Key responsibilities and duties include:
Process Development:
- Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.
- Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity
- Establish and improve process management projects to deliver technology node requirements
Equipment and Materials:
- Evaluate and promote new equipment and materials to enhance process capabilities
- Set up process parameters for a variety of semiconductor equipment
- Evaluate, promote, and plan for new equipment and materials
Quality Improvement:
- Ensure defense coverage through process, measurement, inspection, and testing
- Establish correlations between defense mechanisms to identify improvement opportunities
- Conduct continuous data analysis to establish advanced controls and identify improvement opportunities
Collaboration and Coordination:
- Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives
- Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
- Ensure smooth transition from new product development, qualification, small volume production to high volume production
- Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product
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