Principal 2.5D/3D Packaging Engineer

We are seeking an experienced and highly motivated MTS/Principal Integration Engineer to lead our Advanced Packaging Program, with a specific focus on 2.5D and 3D heterogeneous integration technologies. The ideal candidate will have extensive knowledge and hands‐on experience in these advanced semiconductor packaging technologies, along with a strong...

MTS Integration & Yield (Advanced Packaging) page is loaded## MTS Integration & Yield (Advanced Packaging)locations: Singaporetime type: Full timeposted on: Posted Yesterdayjob requisition id: JR- **About** **GlobalFoundries**GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication...

**Responsibilities** - Design and develop next generation optical interposers leveraging silicon/TSV and advanced 2/5/3D IC packaging solutions. - Define package stack-up, routing and PDN requirements for new products. - Work with external vendors to develop wafer processes and integration for 2.5D/3D heterogeneous integration. - Manage wafer lot handling...

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next‐generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create...

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create...

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire...

**Purpose of the Job**: - To support R&D activities for 2.5D wafer-level packaging (WLP) processes—including Die Preparation, Chip Attach, and Mold—focusing on process reliability, manufacturability, and integration for advanced semiconductor packages. **Key Job Accountabilities**: - Develop and optimize key 2.5D CoW (Chip-on-Wafer) processes: Die...

Responsibilities Perform 2.5D/3DIC platform development. New unit module development and devices development. New process verification and qualification. New platform DSM setup. Customer engagement and new product verification. Requirements Bachelor's degree in Microelectronics/Electronics/Electrical/Physics/Materials engineering or other relevant fields....

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire...

Be part of an exciting team working on cutting-edge advanced packaging process technologies. Participate in process development and integration solution to enable advanced packaging process technologies in the world of mobile, IoT, consumer and high-performance computing area. Partner and work with various teams from inside and outside of Applied Materials...