Principal Engineer
4 days ago
**Responsibilities**
- Design and develop next generation optical interposers leveraging silicon/TSV and advanced 2/5/3D IC packaging solutions.
- Define package stack-up, routing and PDN requirements for new products.
- Work with external vendors to develop wafer processes and integration for 2.5D/3D heterogeneous integration.
- Manage wafer lot handling and define metrology inspection process control requirements.
- Analyze process data and provide technical feedback to drive product development.
- Manage critical technical deliverables, timeline and provide regular updates to management and stakeholders.
- Perform analysis on packaging process specs performance, yield, manufacturing cost and cycle-time; andcontribute in planning and execution of essential improvement programs.
- Provides documentation & regular technical reporting, and technical support and coordination with the CompanyNPI teams to fulfil the Company Technology and Product Development programs.
**Requirements**:
- Minimum a degree in Engineering
- Minimum 8-10 years of relevant experience
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