Senior Staff Optical Packaging Design Engineer
15 hours ago
About Marvell
Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities.
At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.
Your Team, Your Impact
Marvell is the leader in data movement interconnects between and inside data centers. We move big data fast, around the globe, with high quality and reliability. We offer semiconductor components and optical subsystems to our networking original equipment manufacture (OEM), optical module, cloud and telecom service provider customers.
What You Can Expect- Develop photonics IC (PIC) and electronics IC (EIC) co-packaging and assembly process flow with OSAT partner..- Define PIC and EIC hybrid integration packaging design rules, process flow, and material sets.- Lead optical package development to establish package manufacturability and reliability.- Define PIC and EIC IO pad frame and 2.5D interposer floor plan.- Develop PIC and EIC interconnect schematic and layout design process.- Collaborate with cross-functional teams consisting of Digital and Analog Circuit designers, Signal/Power Integrity, and substrate layout, and system design team.- Drive optical product package qualification activities from initial concept to production.
What We're Looking For- Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5-10 years of related professional experience. Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 3-5 years of experience.- Familiarity or direct development or production experience in designing hybrid multi-chip integration using 2.5D/3D packaging.- Direct experience in device or package characterization and testing as required in the development environment. High speed testing background is preferred.- A strong understanding of wafer level packaging process flow.- Ability to work on MCM package signal/power integrity is plus.- Experience in MCM package mechanical drawing is a plux.- Direct experience in collaborating with major OSAT for developing advanced packaging technology for high-speed optics and/or electronics IC is a plus.- Ability to work with a large body of data and the necessary statistical analysis tools, and the ability to present the data and ideas to a diverse audience.- Effective communication and presentation- Team player. Expected to work with cross-functional team.
Additional Compensation and Benefit Elements
With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity. We’re dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us. For additional information on what it’s like to work at Marvell, visit our
Careers
page.
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.
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