Technical Packaging Specialist
6 days ago
Job Description
The primary responsibility of this role is to ensure the quality and conformance of materials in a semiconductor manufacturing environment.
Key Responsibilities:
- Lead teams of engineers and inspectors in performing yield and product gating checks, driving performance improvement, and aligning with production goals.
- Responsible for backend semiconductor packaging processes including ball drop, bumping, singulation, backgrind, and mounting.
- Develop or enhance procedures and work instructions related to backend PQC processes.
- Provide engineering support to meet targets for output, product quality, efficiency, yield, cycle time, and safety.
- Perform data analysis using statistical tools, summarize findings, and present results to relevant stakeholders.
- Drive and facilitate meetings to mitigate yield loss, create action roadmaps, and implement continuous improvement strategies with cross-functional teams.
- Identify chronic process and quality issues and implement permanent corrective actions.
- Collaborate with OSAT process/integration teams to resolve process-related defects impacting yield and product quality.
- Ensure audit readiness for internal and external audits and manage timely closure of findings.
Requirements:
- Bachelor's Degree in Engineering (Mechanical, Electrical, Materials, Chemical, or a related field).
- Minimum 5 years of relevant experience in backend semiconductor packaging processes and quality control.
- Strong foundation in process engineering, yield improvement, and quality control.
- Proficient in SPC and data analysis tools.
- Familiarity with FMEA, Control Plans, and OSAT backend processes.
- Hands-on experience with new product and process evaluations.
- Effective communicator; capable of presenting data and driving cross-team collaboration.
- Able to thrive in a fast-paced, high-volume manufacturing environment.
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