Senior/Engineer, Advanced Packaging Die Level Technology

1 week ago


Singapore Micron Technology Full time

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team focused on using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help enable everything from virtual reality experiences to breakthroughs in neural networks, while committing to integrity, sustainability, and giving back to communities.
We are currently experiencing a transformative period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. High bandwidth memory (HBM) is at the forefront of these innovations. Micron's Advanced Packaging Technology Development (APTD) delivers package development for high performance memory products and



  • Singapore Micron Technology Full time

    Join to apply for the Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering role at Micron Technology 6 days ago Be among the first 25 applicants Join to apply for the Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering role at Micron Technology Our vision is to transform how the world uses information...


  • Singapore Micron Technology Full time

    Join to apply for the MTS/ Principal/ Senior/Engineer, Advanced Packaging Die Level Technology role at Micron Technology 6 days ago Be among the first 25 applicants Join to apply for the MTS/ Principal/ Senior/Engineer, Advanced Packaging Die Level Technology role at Micron Technology Our vision is to transform how the world uses information to enrich...


  • Singapore beBeePackaging Full time $80,000 - $120,000

    Advanced Packaging Die Level Technology EngineerWe are seeking a highly skilled Advanced Packaging Die Level Technology Engineer to join our team. As an experienced professional in this field, you will play a crucial role in the development of high-performance memory products.About the RoleThe successful candidate will be responsible for leading the design...


  • Singapore beBeeEngineering Full time $90,000 - $120,000

    Advanced Packaging Die Level Technology EngineeringWe are seeking a skilled Engineering professional to join our team.Design, develop, and implement advanced packaging solutions for die-level technologyCollaborate with cross-functional teams to deliver high-performance memory productsStay up-to-date with industry trends and advancements in memory and compute...


  • Singapore beBeeEngineering Full time $90,000 - $120,000

    Senior Engineer for Advanced Packaging Die Level Technology EngineeringWe are seeking a highly skilled Senior Engineer to join our team and contribute to the development of cutting-edge technology solutions.Develop and implement advanced packaging technologies to improve memory product performance.Collaborate with cross-functional teams to design, test, and...


  • Singapore Micron Full time

    **Our vision is to transform how the world uses information to enrich life for all.** Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it...


  • Singapore beBeePackaging Full time $90,000 - $120,000

    Job DescriptionWe are seeking a highly skilled and motivated professional to join our team as an Advanced Packaging Die Level Technology Engineer. In this role, you will be responsible for developing and implementing advanced packaging technologies to meet the demands of high-performance memory products.The ideal candidate will have a strong background in...


  • Singapore Micron Technology Full time

    Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering Join to apply for the Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering role at Micron Technology Principal/Senior/Engineer, Advanced Packaging Wafer Level Technology Engineering 1 week ago Be among the first 25 applicants Join to apply for the...


  • Singapore Micron Technology Full time

    Senior/ Engineer, Advanced Packaging Wafer Level Technology - Post Wafer Fabrication(PWF)/ Assembly page is loaded Senior/ Engineer, Advanced Packaging Wafer Level Technology - Post Wafer Fabrication(PWF)/ Assembly Apply locations Fab 10A, Singapore time type Full time posted on Posted Yesterday job requisition id JR76649Our vision is to transform how the...


  • Singapore beBeeInnovation Full time $80,000 - $120,000

    Job DescriptionWe are on a mission to transform the way information is used to enrich life for all. Our team is passionate about using expertise in the relentless pursuit of innovation, enabling high value technology solutions for customers and partners.The solutions we create make everything from virtual reality experiences to breakthroughs in neural...