Advanced Packaging Die Level Technology Engineer
2 weeks ago
We are seeking a highly skilled Advanced Packaging Die Level Technology Engineer to join our team. As an experienced professional in this field, you will play a crucial role in the development of high-performance memory products.
About the RoleThe successful candidate will be responsible for leading the design and development of advanced packaging technologies for high-bandwidth memory products. This includes developing and implementing new package architectures, materials, and processes that meet or exceed performance and cost targets.
You will work closely with cross-functional teams, including engineering, manufacturing, and quality assurance, to ensure seamless integration and delivery of these technologies.
Requirements- Ph.D. in Electrical Engineering, Materials Science, or related field
- Minimum 8 years of experience in advanced packaging technology development, with a focus on high-bandwidth memory products
- Proven track record of innovation and leadership in technical teams
- Strong understanding of semiconductor manufacturing processes and materials science principles
As an employee of our organization, you can expect:
- A competitive salary and bonus structure
- A comprehensive benefits package, including medical, dental, and vision coverage
- Opportunities for professional growth and development through training and mentorship programs
- A dynamic and inclusive work environment that values diversity, equity, and inclusion
We aim to transform how the world uses information to enrich life for all. We believe that innovation is key to achieving this vision, and we are committed to creating an environment that fosters creativity, collaboration, and continuous learning.
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