Highly Skilled Semiconductor Power Packages Designer Wanted
2 weeks ago
Company Overview:
The Supreme HR Advisory Pte Ltd is a leading recruitment agency in Singapore, specializing in placing top talent in the technology industry.
Job Description:
We are seeking a highly skilled Semiconductor Power Packages Designer to join our client's team. The successful candidate will be responsible for designing innovative power packages based on PEP technologies for semiconductor applications using IGBT, GaN, SiC and Si Mosfet devices with device driver integration where reasonable.
Key Responsibilities:
- Design with customer support innovative package based on PEP technologies for Semiconductor Power Applications using IGBT, GaN, SiC and Si Mosfet devices with device driver integration where reasonable
- Perform design rule checks (DRC) and edit data to comply with manufacturing guidelines. (DFM)
- Identify limitations of the design and suggest improvements to meet DFM for new products. Provide feedback on process critical dimensions and product features.
- Itemize and correspond to design Issues with customers.
- Perform Package layout, identifying stackup specifications as appropriate and prepare designs for production
- Identify and lead any prototype work required in early design stage to verify use of new technology or concepts in product or process design to reduce risk and improve profitability.
- Recommend new design concepts and validate the concept feasibility using thermal/electrical modelling
- Perform package reliability test according to the Semi standard specifications to ensure and improve the package robustness according to the mission profile defined by the customer or by application.
- Follow the customer characterization and qualification of the power package
- Provide technical support to process engineers to evaluate and provide strategy for advanced processing / implementation of product packaging
Requirements:
To be successful in this role, you will need:
- Degree / Diploma in Electronic Engineering or equivalent
- Good engineering foundation and technical knowledge
- PCB / Substrate manufacturing knowledge
- 2D and 3D design know-how (AutoDesk preferred)
- Background on semiconductor packaging and assembly processes
- Knowledge with semiconductor power packaging assembly (interconnection, epoxy encapsulation, thermal dissipation, electrical impedance)
- Must be willing to travel both international and domestic as required to remote plants, facilities, customers or suppliers.
- Senior and Staff level with at least 5 years experience in related field.
Estimated Salary: $120,000 - $180,000 per annum, depending on experience.
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