Senior Power Packaging Expert

1 day ago


Singapore THE SUPREME HR ADVISORY PTE. LTD. Full time

At THE SUPREME HR ADVISORY PTE. LTD., we are seeking a highly skilled Senior Power Packaging Expert to join our team. This is an exciting opportunity for individuals with experience in power semiconductor packaging and assembly processes.

About the Role

We are looking for a seasoned expert with a strong background in electronic engineering and technical knowledge. The successful candidate will have extensive experience in semiconductor packaging, including design, manufacturing, and testing. A solid understanding of PCB/substrate manufacturing and 2D/3D design skills (preferably using Autodesk) is essential.

The ideal candidate will have at least 5 years of experience in the field and be willing to travel internationally and domestically to remote plants, facilities, customers, or suppliers.

Key Responsibilities
  • Design innovative packages based on PEP technologies for Semiconductor Power Applications using IGBT, GaN, SiC, and Si Mosfet devices with device driver integration where reasonable.
  • Perform design rule checks (DRC) and edit data to comply with manufacturing guidelines (DFM).
  • Identify limitations of the design and suggest improvements to meet DFM for new products. Provide feedback on process critical dimensions and product features.
  • Itemize and correspond to design issues with customers.
  • Perform package layout, identifying stackup specifications as appropriate and prepare designs for production.
  • Identify and lead any prototype work required in early design stages to verify the use of new technology or concepts in product or process design to reduce risk and improve profitability.
  • Recommend new design concepts and validate the concept feasibility using thermal/electrical modeling.
  • Perform package reliability tests according to Semi standard specifications to ensure and improve the package robustness according to the mission profile defined by the customer or by application.
  • Follow the customer characterization and qualification of the power package.
  • Provide technical support to process engineers to evaluate and provide strategy for advanced processing/implementation of product packaging.
Requirements
  • Degree/Diploma in Electronic Engineering or equivalent.
  • Good engineering foundation and technical knowledge.
  • PCB/Substrate manufacturing knowledge.
  • 2D and 3D design know-how (Autodesk preferred).
  • Background on semiconductor packaging and assembly processes.
  • Knowledge with semiconductor power packaging assembly (interconnection, epoxy encapsulation, thermal dissipation, electrical impedance).
  • Must be willing to travel both internationally and domestically as required to remote plants, facilities, customers, or suppliers.
  • Senior and Staff level with at least 5 years' experience in related fields.
Benefits

This role offers a competitive salary range between SGD $80,000 - SGD $120,000 per annum, depending on experience and qualifications. We also offer excellent benefits and career development opportunities within THE SUPREME HR ADVISORY PTE. LTD.



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