Senior Power Electronics Packaging Specialist
7 days ago
Job Overview
The Supreme HR Advisory Pte Ltd is seeking a highly skilled Senior Power Electronics Packaging Specialist to join their team. As a key member of the organization, you will be responsible for designing and developing innovative power packages using cutting-edge technologies.
About the Role
This is a full-time position based in Singapore (Admiralty) with a competitive salary range of up to SGD 10,000 per month. The successful candidate will work on exciting projects, collaborating with customers and internal stakeholders to deliver high-quality solutions.
Key Responsibilities
- Design and develop innovative power packages using IGBT, GaN, SiC, and Si MOSFET devices with device driver integration where feasible.
- Perform design rule checks (DRC) and edit data to comply with manufacturing guidelines (DFM).
- Identify limitations of designs and suggest improvements to meet DFM requirements for new products, providing feedback on process-critical dimensions and product features.
- Itemize and correspond to design issues with customers.
- Develop package layouts, identifying stackup specifications as necessary, and prepare designs for production.
- Lead prototype work required in early design stages to verify the use of new technology or concepts in products or processes to reduce risk and improve profitability.
- Recommend new design concepts and validate their feasibility using thermal/electrical modeling.
- Perform package reliability tests according to Semi standard specifications to ensure and improve package robustness according to mission profiles defined by customers or applications.
- Follow customer characterization and qualification of power packages.
- Provide technical support to process engineers to evaluate and provide strategies for advanced processing/implementation of product packaging.
Requirements
- Degree/Diploma in Electronic Engineering or equivalent.
- Good engineering foundation and technical knowledge.
- PCB/Substrate manufacturing knowledge.
- 2D and 3D design expertise (AutoDesk preferred).
- Background on semiconductor packaging and assembly processes.
- Knowledge of semiconductor power packaging assembly (interconnection, epoxy encapsulation, thermal dissipation, electrical impedance).
- Willingness to travel internationally and domestically as required to remote plants, facilities, customers, or suppliers.
- Senior and Staff level with at least 5 years of experience in related fields.
Tell Employers What Skills You Have
Customer Support
Electrical
3D
Reliability
Strategy
Characterization
Packaging
Assembly Processes
Assembly
Manufacturing
Layout
Technical Support
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