Advanced Semiconductor Assembly Expert

1 week ago


Singapore beBeeLaser Full time $80,000 - $120,000
Job Opportunity

The Laser Bonding Specialist is responsible for developing, optimizing and maintaining advanced laser bonding processes – especially in high-precision, high-reliability applications for Chip-to-Wafer or Chip-to-Substrate bonding.

Main Responsibilities:
  • Laser-Assisted Bonding Development & Optimization: Develop, implement and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly, including recipe creation and parameter optimization to achieve maximum yield, quality and throughput.
  • Process Scale-Up & Qualification: Qualify new laser bonding processes from R&D to high-volume production, working with both development and production teams.
  • Equipment Management: Specify, program and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products.
  • Troubleshooting & Support: Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality and reliability issues in collaboration with operators and maintenance teams.
  • Continuous Process Improvement: Lead initiatives to improve yield, cycle time and cost – using data-driven methodologies such as Statistical Process Control (SPC) and Six Sigma tools.
  • Documentation: Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology transfer.


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