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Senior Technologist for Advanced RF Module Development
3 weeks ago
As a Senior Staff R&D Design Technology Integration Engineer, you will be responsible for the development of advanced technologies for RF Front End Modules. You will work directly with product development teams to support the integration of new technologies into existing products.
You will utilize your expertise in process integration between fabrication facilities and outsourced semiconductor assembly and test companies to anticipate and address potential integration challenges. In-depth knowledge of Backend-of-the-Line (BEOL) processes is required, as well as experience in photolithography techniques.
Conversant with substrate and assembly packaging processes for RF-SiP applications, you will formulate industry-leading design guidelines that incorporate lessons from past failures and acknowledge manufacturing constraints.
Key responsibilities include creating, conducting, and analyzing Design of Experiments (DOE) for development activities, especially those related to bump/die sort quality, yield, and impact on CPI. You will also support the development of advanced technologies for RF-SiP applications and lead all aspects of technology integration into products.
Required Skills and Qualifications- Master's Degree or equivalent in Mechanical / Materials / Chemical Engineering, PhD preferred
- 10+ years of experience desired in electronics packaging in related environments, especially RF module industry
- At least 5 years direct experience in process engineering, product integration, or quality management at tier 1 foundries or assembly sub-contractors
- Solid technical understanding of full range of Semiconductor packaging materials, material interactions, processes, dominant failure mechanisms, and analytical techniques
- Good knowledge of packaging industry standards (IPC, JEDEC, IEEE, ISO, ANSI)
- Excellent communication skills
- Willingness to travel internationally, typically once per quarter
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