
Senior Semiconductor Process Specialist
2 weeks ago
Job Title: Senior Semiconductor Process Specialist
About the RoleWe are seeking a highly skilled and experienced Senior Semiconductor Process Specialist to join our team. In this role, you will be responsible for developing and optimizing temporary bonding and debonding (TBDB) processes for advanced packaging applications.
Main Responsibilities- Develop and optimize TBDB process flows including wafer thinning, bonding, and debonding.
- Select appropriate materials and stabilize related process conditions.
- Analyze compatibility with downstream processes and perform process tuning accordingly.
- Investigate and resolve defect issues such as voids, warpage, and delamination.
- Coordinate TBDB equipment installation and optimize process parameters.
- Bachelor's degree or higher in engineering disciplines such as Materials Science, Mechanical Engineering, Chemical Engineering, Electronics, or Advanced Materials.
- Minimum 3 years of hands-on experience in TBDB process development.
- Understanding of material properties for adhesives, carriers, and thermal interface materials.
- Familiarity with semiconductor back-end or advanced packaging process flows.
- Strong skills in experiment design, data analysis, and process documentation.
- Excellent problem-solving and root cause analysis capabilities in process-related issues.
- Experience in advanced packaging technologies such as 2.5D/3D, TSV, CoWoS, and fan-out.
- Hands-on experience with TBDB equipment operation.
- Knowledge of adhesive and laser debonding techniques.
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