CMOS Process Integration Specialist

7 days ago

Singapore beBeeIntegration Full time $150,000 - $200,000
Role Overview

We are seeking a highly skilled CMOS Process Integration Specialist to join our team.

This role is responsible for developing 3D NAND CMOS devices, scaling and enhancing their performance, reliability, and manufacturability.

Key Responsibilities:
  • Develop and innovate critical CMOS modules. Drive multi-functional teams to optimize existing process flows and develop new innovative solutions to meet product requirements and manufacturability.
  • Develop/re-define critical specifications criteria for optimum product performance and drive activities to get them to manufacturing process capability.
  • Extract and analyze inline, probe, parametric, reliability, and other critical metrics and predict future behavior of the CMOS device performance of the product to enable early innovative solutions to meet product and device specifications.
  • Early introduction, characterization, and validation of new CMOS device models and test structures for developing future NAND products.
  • Three-dimensional analysis with the use of K2 view to extract layout information and combine with the doping profiles of each implant step for product development and integration solutions.
  • Interact and collaborate with TCAD, modeling, and layout teams to drive clearer definition of CMOS device and reliability improvements across multiple tech-nodes and designs.
  • Coordinate activities at manufacturing sites towards gating experiment funding, conversions, and effectively communicate decisions made to all R&D, manufacturing, and relevant partners.
  • Taking on leadership roles at quarterly yield summits and monthly program reviews in summarizing complex problems, deriving and explaining actions taken to address them, and getting R&D, manufacturing, and senior management teams on the same page.
  • Assisting in the transfer of a new technology from R&D to manufacturing and contributing towards ensuring successful ramp and qualification. Supporting the transfer, documentation, and training of module fundamentals into manufacturing.
Requirements:
  • Masters or PhD in Electrical Engineering preferably specialized in Microelectronics and Semiconductor Device Physics. Prior technology development and tech transfer/manufacturing experiences are preferred.
  • Direct fab experience with nonvolatile memories manufacturing, knowledge of TCAD, K2 view layout, and NAND product are highly desirable.
  • Ability to develop a strong, holistic, end-to-end understanding of CMOS device and its related module on NAND technologies, related structural and electrical fail mechanisms.
  • Deep understanding of probe failure mechanism, ability to do electrical bench data collection.
  • Self-motivated, self-governing with proven ability to work in a demanding and dynamic environment.
  • Experienced in coordinating cross-functional teams to achieve a goal.
  • Solid data analysis, communication, and reporting abilities with demonstrated presentation abilities.
  • Curiosity and natural tendency of learning new things independently.
  • Opportunity to travel for extended periods of time for collaborative R&D work.

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