Post-Fab Wafer Finish Engineer

2 weeks ago

Singapore beBeePackaging Full time $1,600,000 - $2,000,000
Advanced Packaging Technology Engineer

We are seeking a highly skilled engineer to join our Advanced Packaging Technology Development team.

As an Advanced Packaging Technology Engineer, you will be responsible for developing and enabling deployment of processes related to the post-fab wafer finishing processes in semiconductor manufacturing.

You will work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives.

Key responsibilities include:

  • Establishing and improving PWF process conditions and technologies (wafer thinning, backside metal interconnect)
  • Evaluating and promoting new equipment and materials to enhance process capabilities
  • Ensuring defense coverage through process, measurement, inspection, and testing

Requirements include:

  • B.S/M.S./Ph.D. (or equivalent education) in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
  • 2 or more years of semiconductor process development, preferably in wafer bonding, plating, warpage control and packaging field

Benefits include:

  • A competitive salary and benefits package
  • The opportunity to work on cutting-edge technology and contribute to the development of innovative solutions

Others include:

  • Opportunities for professional growth and development
  • A collaborative and dynamic work environment

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