Packaging Solutions Specialist

1 week ago

Singapore beBeeIntegration Full time $90,000 - $120,000

**Job Title:** Advanced Packaging Integration Expert

About the Role

We are seeking a skilled development integration engineer to lead advanced packaging process integration, focusing on die-to-wafer (D2W) and wafer-to-wafer (W2W) bonding solutions for ultra-low power (ULP) CMOS platforms.

The role encompasses early-stage process development through to manufacturing. If you have expertise in process development, engineering, and technical leadership, we want to hear from you.

Key Responsibilities
  • Lead the development and implementation of advanced packaging processes for ULP CMOS platforms.
  • Collaborate with cross-functional teams to ensure seamless process integration and delivery.
  • Design, develop, and test new packaging solutions to meet performance, cost, and reliability requirements.
  • Analyze and resolve complex technical issues related to packaging process integration.
Requirements
  • BS/MS degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
  • Minimum 5 years of experience in process development, engineering, and technical leadership.
  • Proven track record of delivering complex projects on time and within budget.
  • Strong knowledge of semiconductor manufacturing processes and materials science.
  • Excellent communication and collaboration skills.
Benefits

We offer a competitive salary, bonus structure, and comprehensive benefits package. Our team is passionate about innovation and excellence, and we strive to create a positive and inclusive work environment.

What We Offer

* Competitive compensation and bonus structure
* Comprehensive benefits package including medical, dental, and vision insurance
* 401(k) retirement savings plan
* Paid time off and holidays
* Opportunities for professional growth and development

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