Lead Packaging Innovator

2 weeks ago


Singapore beBeePackaging Full time $120,000 - $180,000
Job Overview

We are a cutting-edge technology team dedicated to solving complex global challenges. Our team thrives in an environment of innovation, collaboration, and inclusivity.

The Position

As a Senior Staff, Packaging Engineer, you will be responsible for designing advanced substrate layouts with strong communication and project management skills. You will work in a fast-paced environment, collaborating closely with colleagues.

Key Responsibilities:
  • Codesign substrate layouts that meet performance, cost, and quality objectives with Signal/Power Integrity and PCB design teams.
  • Support substrate design for probe card substrates, test chips, and test vehicles for technology development.
  • Codesign Bump matrix and Interposer designs with SOC teams for 3D, 2.5D, COWOS, and other advanced packaging technologies (Chiplet).
  • Contribute to process enhancements and methodologies to improve design efficiency.
  • Interact with assembly houses and vendors to achieve cost-efficient and high-quality designs.
  • Mentor junior colleagues to enhance layout practices.
Required Skills and Qualifications:
  • Minimum 8 years' experience in designing complex substrate designs or Silicon Interposers.
  • Strong understanding of Signal Integrity and Power Integrity principles.
  • Proficient in CAD Layout tools such as Cadence SIP, APD, Synopsys 3DICC, First Encounter, ICC2, or other relevant software.
  • Familiarity with scripting languages like Python, TCL, Perl is beneficial.
  • Experience dealing with assembly, foundry, and substrate vendors.
Academic Requirements:
  • Bachelor of Science degree in Electrical Engineering, Computer Engineering, or Engineering Science.


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