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Thermal Analysis and Design Engineer

2 weeks ago

Singapore beBeePackaging Full time $100,000 - $150,000
Job Title: Thermal Analysis Engineer

We are seeking a skilled Thermal Analysis Engineer to join our team. As a Thermal Analysis Engineer, you will be responsible for performing thermal analysis and characterization of advanced IC packages.

  • Perform thermal analysis and characterization of advanced IC packages
  • Build up new thermal capabilities with latest simulation and characterization technologies
  • Design advanced packages for customers to meet their reliability and manufacturability specifications & needs
  • Assess the feasibility of new packaging assembly and process technologies with respect to thermal performance
  • Conduct IC packaging technology development together with other teams
  • Carry out thermal tests and correlate with thermal simulation for validation
Requirements:
  • Degree / Master in Mechanical Engineering or related field
  • Solid knowledge on FEM & mechanics of material
  • Mechanical modeling experience for IC package's stress & warpage, board-level reliability such as drop test & TCOB using simulation software such as Ansys or Abaqus is a must
  • Thermo-mechanical modeling experience for IC assembly molding process, die stress/shifting in WLCSP, and wire bonding using simulation software such as Ansys & Abaqus is preferable
  • Mechanical and reliability test experience such as drop test, TCOB test, warpage measurement, bending test, material strength test is highly desirable
  • Thermal Modeling experience using CFD software such as Flotherm / Icepak is highly desirable
  • Team player with good interpersonal and communication skills
  • Keen for R&D activities in IC packaging technology development, package's mechanical & thermal analysis/design/optimization/characterization
Tell employers what skills you have

Key Skills Include:
  • Thermal Analysis
  • Modeling
  • Stress
  • Technology Development
  • Reliability
  • Characterization
  • Packaging
  • Abaqus
  • Communication Skills
  • Molding
  • Team Player
  • Assembly
  • IC
  • Mechanical Engineering
  • ANSYS