Innovative Packaging Solutions Developer

2 days ago

Singapore beBeeMicroelectronics Full time $120,000 - $200,000
Job Opportunity

Develop innovative packaging solutions in a collaborative environment.

Key Responsibilities:
  • Design and implement chip packaging solutions that meet high standards of quality and performance.
  • Work with cross-functional teams to resolve interface-related issues and optimize signal integrity (SI) and power integrity (PI).
  • Ensure seamless integration of complex SoC chips with various high-speed interfaces such as DDR, PCIe, and Serdes.
Requirements:
  • Master's degree or higher in Microelectronics, Electronics, Communications, Computer Science, or related fields.
  • Minimum 2 years of relevant work experience in EDA tools for packaging and PISI fields.
  • Proven expertise in undertaking PISI work for complex SoC chips and strong knowledge of packaging structures, reliability, thermal performance, and high-speed/high-frequency interface protocols.
  • Excellent communication skills and fluency in English reading and writing.
Preferred Qualifications:
  • Strong teamwork spirit and responsible work attitude.

This role is ideal for individuals who thrive in dynamic environments and are passionate about developing cutting-edge packaging solutions.

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