
Sr Associate Engineer, Failure Analysis
2 weeks ago
Responsibilities:
- Perform TEM (transmission electron microscopy) sample preparation using Focused-ion beam/Scanning Electron Microscope for semiconductor failure analysis and characterization.
- Perform pre-FIB related sample preparation such as optical microscope inspection, Si wafer navigation, chip delayering, RIE etching, sputter coating, and etc.
- Participate in new failure analysis techniques development and evaluation of new technologies
- Demonstrate a sense of urgency and quality mindset to support urgent and critical Fab operation requests.
Requirements:
- Diploma in Engineering (Electrical / Electronics / Mechatronics and Microelectronics Engineering)
- This role requires to work in the 12hr night-shift pattern.
- Fast learning and good hands-on capability
- Hands-on experience on FIB for TEM sample preparation is preferred.
- Basic knowledge in semiconductor field
- Good interpersonal and communication skills, team workers, independent and self-disciplined.
Preventive Maintenance
Troubleshooting
Housekeeping
Electrical
Transmission Electron Microscopy
TEM
Characterization
Customer Returns
SPC
Communication Skills
Manufacturing
Layout
Electronics
Calibration
EHS
Failure Analysis
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