Engineer, Product Engineering

Roles & Responsibilities

As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron's latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI's Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating.

Responsibilities:

• Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects.
• Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution.
• DPM reduction: Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI's Quality, Cost and Cycle Time
• Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration.
• Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products, which are key components in many modern technologies.
• Risk Management: The role requires communication with Product Managers/Leads to manage risks associated with DPM process conversions. This is crucial in ensuring that the conversions move at an appropriate pace, balancing the need for innovation with the need for stability and reliability.
• Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron's competitive edge in the market.
• Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.
• Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.
• Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.
• Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

Requirements

• Bachelor's or Master's degree in Electrical and Electronics Engineering or a related field.
• Coursework or internship experience in semiconductor devices, circuit design, or product validation is a plus.
• Solid understanding of problem-solving methodologies, with a focus on identifying root causes and exploring solution spaces.
• Familiarity with CMOS technology, DRAM architecture, and basic device physics.
• Exposure to data analysis, statistics, and scripting tools such as Python or JMP.
• Strong attention to detail and a commitment to quality.
• Ability to work effectively in team-based projects, contributing to shared goals and outcomes.
• Flexible and eager to learn, with a willingness to take on diverse roles in a dynamic engineering environment.
• Responsible and accountable, with a professional work ethic and ownership of assigned tasks.
• Clear and effective communication skills in written and spoken English, especially when articulating technical concepts and findings

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

Tell employers what skills you have

Team Collaboration
Charter
Strong Attention To Detail
Technology Development
Physics
Risk Management
Product Engineering
Circuit Design
Reliability
Mentorship
Project Management
CMOS
Test Strategy
Test Development
Decision Making
Failure Analysis

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