Senior Scientist, HI, IME
5 days ago
He/she will workwith cross functional team to:
- Designand simulation of superconducting circuits for salable quantumprocessor in 3D flip-chip architecture.
- Explore and develop superconducting nanowire base photodetector.
- Design and layout of circuitscomponents of a superconducting qubit.
- Developdesign rules and PDK for quantum packaging technologies.
- Provide quantum packaging solutions to meet the systemrequirements based on the simulation results.
Preparecompetitive grant research proposals and lead execution of theseproposals.
Engage industry partners to align and developthe building blocks required for next generations quantum packagingplatforms.
JobRequirements:
- Master/PhD in quantumcomputing; Electrical and Computer Engineering; Material sciencearea
- 4 to 5 years' experience insuperconducting circuits design and simulation for scalable quantumprocessor. Deep understanding on 3D quantum package
- Working experience on measuring loss and dielectricconstants of materials at cryogenic temperatures
- Strong communication, industry awareness, andproblem-solving skills.
- Highly motivated tosucceed, a self-starter who is driven and able to work with otherseffectively to get things done.
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