thermo

Position title : Senior Advanced Packaging Application Engineer / Process Engineer (Thermo Compression Bonding – TCB) Location: Admirax St Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary :SGD 8,000 – SGD 10,000/month (Based on experience and technical capability) Responsibilities: Customer Application Engineering Understand...

Position title : Senior Advanced Packaging Application Engineer (Thermo Compression Bonding - TCB) Location: Woodlands/Sembawang Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : SGD 8,000 - SGD 10,000/month (Based on experience and technical capability). Responsibilities Customer Application Engineering Understand customer packaging...

Position title : Semiconductor Advanced Packaging Application Engineer (Thermo Compression Bonding) Location: Admirax St Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary :SGD 8,000 – SGD 10,000/month (Based on experience and technical capability) Responsibilities: Customer Application Engineering Understand customer packaging roadmaps...

Position title : Semiconductor Advanced Packaging Application Engineer (Thermo Compression Bonding) Location: Admirax St Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary :SGD 8,000 – SGD 10,000/month (Based on experience and technical capability) Responsibilities: Customer Application Engineering Understand customer packaging...

Position title : Senior Advanced Packaging Application Engineer (Thermo Compression Bonding - TCB) Location: Woodlands/Sembawang Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : SGD 8,000 - SGD 10,000/month (Based on experience and technical capability). Responsibilities Customer Application Engineering Understand customer packaging...

Position title: Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary :SGD 8,000 – SGD 10,000/month (Based on experience and technical capability). Responsibilities Customer Application Engineering Understand customer packaging roadmaps and...

Position title: Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) Location: AdmiraltyWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary :SGD 8,000 – SGD 10,000/month (Based on experience and technical capability). Responsibilities Customer Application Engineering Understand customer packaging roadmaps and...

Key ResponsibilitiesProcess Setup:Program and optimize die-attach, eutectic, and thermo-compression bonding equipment.Application Engineering:Evaluate customer requirements, run feasibility studies, and manage sample fabrication for New Product Introduction (NPI).Quality & Inspection:Set up Automated Optical Inspection (AOI) programs and establish criteria...

Work ScheduleFirst Shift (Days)Environmental ConditionsOfficeJob DescriptionJob DescriptionJoin Us as an Associate Sample Coordinator – Make an Impact at the Forefront of InnovationAt Thermo Fisher Scientific, you’ll discover meaningful work that makes a positive impact on a global scale. Join our colleagues in bringing our Mission to life - enabling our...

Work Schedule First Shift (Days)Environmental Conditions Job Description Job DescriptionJoin Us as anAssociate Sample Coordinator– Make an Impact at the Forefront of InnovationAt Thermo Fisher Scientific, you’ll discover meaningful work that makes a positive impact on a global scale. Join our colleagues in bringing our Mission to life - enabling our...

Position title : Senior Advanced Packaging Application Engineer (Thermo Compression Bonding - TCB) Location: Admirax St Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary :SGD 8,000 - SGD 10,000/month (Based on experience and technical capability) Responsibilities: Customer Application Engineering Understand customer packaging roadmaps...

Position title : Senior Advanced Packaging Application Engineer / Process Engineer (Thermo Compression Bonding – TCB) Location: Admirax St Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary :SGD 8,000 – SGD 10,000/month (Based on experience and technical capability) Responsibilities: Customer Application Engineering Understand...

Work Schedule First Shift (Days) Environmental Conditions Job Description Job Description Join Us as an Associate Sample Coordinator – Make an Impact at the Forefront of Innovation At Thermo Fisher Scientific, you’ll discover meaningful work that makes a positive impact on a global scale. Join our colleagues in bringing our Mission to life -...

Position title : Senior Advanced Packaging Application Engineer (Thermo Compression Bonding - TCB) Location: Admirax St Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary :SGD 8,000 - SGD 10,000/month (Based on experience and technical capability) Responsibilities: Customer Application Engineering Understand customer packaging roadmaps...

Position title : Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) Location: Admirax StWorking Days: 5 Day A WeekWorking hours : 9:00am - 6:00pmSalary :SGD 8,000 – SGD 10,000/month (Based on experience and technical capability) Responsibilities: Customer Application Engineering Understand customer packaging roadmaps and...

Roles & Responsibilities Position title : Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) Location: Woodlands/Sembawang Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : SGD 8,000 – SGD 10,000/month (Based on experience and technical capability). Responsibilities: Customer Application...

Position title : Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) | HBM | CoWoS | 2.5D/3D Packaging | Flip Chip | Advanced Semiconductor Packaging | Process Development Location: Admirax St Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary :SGD 8,000 – SGD 10,000/month (Based on experience and...

Position title : Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) | HBM | CoWoS | 2.5D/3D Packaging | Flip Chip | Advanced Semiconductor Packaging | Process Development Location: Admirax St Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary :SGD 8,000 – SGD 10,000/month (Based on experience and...

You will work on the thermo-mechanical reliability of next-generation semiconductor packages, combining hands-on materials characterisation with finite element modelling. The work spans the full loop from material and interface testing through to multi-scale simulation and validation on real packaged test vehicles, in collaboration with colleagues at IME and...

Position title : Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) | HBM | CoWoS | 2.5D/3D Packaging | Flip Chip | Advanced Semiconductor Packaging | Process Development Location: Admirax St Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary :SGD 8,000 – SGD 10,000/month (Based on experience and...