chippac

207 chippac job listings in Singapore. Find daily updated positions from leading job boards.


  • singapore STATS CHIPPAC PTE. LTD. Full-time

    STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients...

  • Strategic Infra

    11 hours ago


    singapore STATS CHIPPAC MANAGEMENT PTE. LTD. Full-time

    STATS CHIPPAC MANAGEMENT PTE. LTD. in Singapore seeks an experienced Infrastructure & Security Senior/Manager to oversee IT infrastructure, cybersecurity governance, vendor management, and technology projects across multiple sites. You will ensure stable and secure IT operations, drive initiatives, coordinate with regional and global IT teams, and support...


  • singapore STATS CHIPPAC MANAGEMENT PTE. LTD. Full-time

    STATS ChipPAC is seeking an Associate Equipment Engineer to support the Molding process, ensuring high equipment availability and production support. The role involves troubleshooting, preventive maintenance, and continuous improvement for Daiichi Mold machines, with 12-hour rotating shifts. You will work with Production and Process Engineering to resolve...


  • singapore STATS CHIPPAC MANAGEMENT PTE. LTD. Full-time

    STATS CHIPPAC MANAGEMENT PTE. LTD. is seeking a semiconductor process engineer to develop, optimize, and qualify Die-to-Wafer processes including Flip Chip and Underfill for advanced packaging applications. You will support process readiness, yield improvement, and NPI, and maintain MES data and process instructions for development builds. You will...


  • singapore STATS CHIPPAC PTE. LTD. Full-time

    STATS ChipPAC PTE. LTD. in Singapore is seeking an Associate Engineer to support wire bond equipment setup, maintenance, troubleshooting and repair in a semiconductor manufacturing environment. Key responsibilities include machine setup and conversion, downtime minimization, preventive maintenance, and root cause analysis, with a requirement for a 12-hour...


  • singapore STATS CHIPPAC MANAGEMENT PTE. LTD. Full-time

    STATS ChipPAC MANAGEMENT PTE. LTD. is seeking a hands-on Associate Engineer to support setup, maintenance, troubleshooting, and repair of wire bond equipment in a semiconductor manufacturing environment. You will work on machine setup, qualification, and conversion, while minimizing downtime through effective troubleshooting. Responsibilities include...


  • singapore STATS CHIPPAC PTE. LTD. Full-time

    STATS ChipPAC PTE. LTD. in Singapore is seeking an Associate Equipment Engineer to support Singulation processes, ensuring high equipment availability and production support. You will troubleshoot, repair Hanmi Singulation machines, perform preventive maintenance, and work closely with Production and Process Engineering to resolve equipment issues. The role...


  • singapore stats chippac pte. ltd. Full-time

    STATS ChipPAC is seeking a Process Associate Engineer to provide technical and administrative support to Process Engineers in the eWLB Dept to ensure total customer satisfaction related to product quality, productivity and cost effectiveness. The role requires assisting with wet/plate equipment issues, guiding junior colleagues, troubleshooting line...


  • singapore stats chippac pte. ltd. Full-time

    stats chippac pte. ltd. in Singapore is seeking a Lithography Process Engineer to support eWLB line activities and meet customer requirements. You will handle process characterization, yield improvement, equipment qualification, and cross functional projects, reporting progress weekly, monthly and quarterly. Candidates should hold a degree in Electrical,...


  • singapore STATS CHIPPAC MANAGEMENT PTE. LTD. Full-time

    STATS ChipPAC is seeking an Associate Equipment Engineer in Singapore to enhance equipment performance, yield and quality while minimizing downtime and costs. The role focuses on line sustaining activities, problem solving, and collaboration with external vendors. The candidate should have a Diploma in Mechanical Engineering and at least 2 years of...


  • singapore STATS ChipPAC, Inc. Full-time

    STATS ChipPAC, Inc. in Singapore seeks an experienced Program Manager to lead strategic customer programs in advanced packaging. You will own programs end-to-end, align engineering, operations and manufacturing, and champion customer voice across the business. You will drive projects from concept through qualification, pilot production and ramp, coordinate...


  • singapore STATS CHIPPAC MANAGEMENT PTE. LTD. Full-time

    STATS ChipPAC is seeking a Senior/Associate Process Engineer to provide technical and administrative support to process engineers in the eWLB Dept to ensure total customer satisfaction related to product quality, productivity and cost effectiveness. You will guide less experienced team members, troubleshoot line issues in wet/plate area, support small...


  • singapore STATS CHIPPAC PTE. LTD. Full-time

    STATS ChipPAC PTE. LTD. is seeking an Associate Equipment Engineer to support the Molding process, ensuring high equipment availability and production support. You will troubleshoot and repair Daiichi Mold machines, perform preventive maintenance, and analyze failures to prevent recurrence. The role requires a Diploma in Electrical or Mechanical Engineering,...


  • singapore STATS CHIPPAC PTE. LTD. Full-time

    STATS CHIPPAC PTE. LTD. is seeking an engineering diploma holder to join the production team in Singapore. The role focuses on solving daily manufacturing issues, improving process accuracy, cycle time, and overall efficiency through data-driven decisions. You will identify root causes, analyze process data, document procedures, and implement corrective...


  • singapore STATS ChipPAC Full-time

    STATS ChipPAC is seeking an experienced Senior Process Engineer to drive process development and scale-up for wafer assembly steps such as back grinding, dicing, laser groove, edge trimming, and lamination in our 2.5D/3D packaging lab. The role focuses on delivering ultra-thin, high-yield, strong diced dies for advanced packaging, with responsibilities...


  • singapore STATS ChipPAC Pte. Ltd. Full-time

    STATS ChipPAC Pte. Ltd. in Singapore is seeking an experienced Process Engineer to drive quality and productivity improvements in semiconductor manufacturing. You will lead cross-functional teams to implement robust process solutions and ensure customer requirements are met. The ideal candidate holds an engineering degree, has at least 3 years of process...


  • singapore STATS CHIPPAC PTE. LTD. Full-time

    STATS ChipPAC PTE. LTD. in Singapore is seeking an Associate Equipment Engineer to improve equipment performance, yield and quality while minimizing downtime and reducing manufacturing costs. You will support production loading with line sustaining activities and work on 12‑hour rotating shifts if required. The role involves vendor liaison and hands‑on...

  • Wafer Singulation

    13 hours ago


    singapore STATS CHIPPAC MANAGEMENT PTE. LTD. Full-time

    STATS CHIPPAC MANAGEMENT PTE. LTD. is seeking a process engineer to develop, optimize, and stabilize wafer/package separation processes such as Laser Grooving, Stealth Dicing, and Blade Dicing in advanced semiconductor packaging. You will lead DOE studies, implement statistical tools (JMP), and drive yield improvements and robust solutions for production....


  • singapore, sg STATS ChipPAC Full-time

    STATS ChipPAC is seeking an experienced Senior Process Engineer to drive process development and scale-up for wafer assembly steps such as back grinding, dicing, laser groove, edge trimming, and lamination in our 2.5D/3D packaging lab. The role focuses on delivering ultra-thin, high-yield, strong diced dies for advanced packaging, with responsibilities...


  • singapore, sg STATS ChipPAC Full-time

    STATS ChipPAC is seeking an experienced Senior Process Engineer to drive process development and scale-up for wafer assembly steps such as back grinding, dicing, laser groove, edge trimming, and lamination in our 2.5D/3D packaging lab. The role focuses on delivering ultra-thin, high-yield, strong diced dies for advanced packaging, with responsibilities...